Macronix International Co., Ltd.

Meng Tsung Ko

Chin Ta Su

Yung Tai Hung

A system is provided that includes a power supply connectable to a semiconductor wafer including opposing, major front and back surfaces joined by a circumferential side, with the wafer undergoing processing including electroplating a damascene layer on the wafer. The system also includes an arrangement configured to apply a polymer coating to the side of the wafer before electroplating the damascene layer, with the system being configured to apply the polymer coating in accordance with an electrophoresis technique driven by the power supply. In this regard, the polymer coating is applied to the side but not at least a portion of the front and back surfaces of the wafer, and the polymer coating provides a barrier to formation of the damascene layer on the side of the wafer.

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Sanchong, Taiwan

Meng Tsung Ko