Globalfoundries Inc.

Meng Luo

Yong Meng Lee

Haiting Wang

Xin Wang

Changyong Xiao

Wen-Pin Peng

Ashish Kumar Jha

Wei Hua Tong

Yue Hu

Jialin Weng

Methods for controlling the length of a replacement metal gate to a designed target gate length and the resulting device are disclosed. Embodiments may include removing a dummy gate from above a substrate forming a cavity, wherein side surfaces of the cavity are lined with an oxidized spacer layer and a bottom surface of the cavity is lined with a gate oxide layer, conformally forming a sacrificial oxide layer over the substrate and the cavity, and removing the sacrificial oxide layer from the bottom surface of the cavity and the substrate leaving sacrificial oxide spacers lining the side surfaces of the cavity.

Using sacrificial oxide layer for gate length tuning and resulting device

Integrated circuits and methods of forming integrated circuits are provided herein. In an embodiment, a method of forming an integrated circuit includes providing a base substrate having an embedded electrical contact disposed therein. An interlayer dielectric is formed overlying the base substrate, and a recess is etched through the interlayer dielectric over the embedded electrical contact. A protecting liner is formed in the recess and over an exposed surface of the embedded electrical contact in the recess. The protecting liner includes at least two liner layers that have materially different etch rates in different etchants. A portion of the protecting liner is removed over the surface of the embedded electrical contact to again expose the surface of the embedded electrical contact in the recess. An embedded electrical interconnect is formed in the recess. The embedded electrical interconnect overlies the protecting liner on sides of the recess.

Integrated circuits and methods of forming integrated circuits with interlayer dielectric protection

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Clifton Park, NY, United States of America

Meng Luo