Advanced Semiconductor Engineering, Inc.

Meng-Jung Chuang

Meng-Jen Wang

Tsung-Yueh Tsai

Yu-Fang Tsai

Cheng-Yin Lee

Chi-Chih Chu

Wei-Chang Tai

Kuang-Lin Lo

Yao-Ting Huang

An optical device package comprises a carrier having a first surface and a second surface recessed with respect to the first surface and a lid disposed on the second surface of the carrier.

Optical device package with compatible lid and carrier

Optical device package

A substrate structure having a solder mask and a process for making the same, including (a) providing a substrate having a top surface, the top surface having a die pad and a plurality of solder pads; (b) forming a first solder mask on the top surface, the first solder mask having a plurality of openings, each opening corresponding to each solder pad so as to expose at least part of the solder pad; and (c) forming a second solder mask on the first solder mask. The substrate structure can be used for packaging a thicker die so as to prevent the die crack and the overflow of molding compound will be avoided.

Substrate structure having a solder mask and a process for making the same

A system-in-package structure includes a carrier substrate having a molding area and a periphery area, at least a chip disposed in the molding area, an encapsulation covering the chip and the molding area, a plurality of solder pads disposed in the periphery area, and a solder mask disposed in the periphery area and partially exposing the surface of the solder pads. The solder mask includes at least a void therein.

System-in-package structure

Growing community of inventors

Kaohsiung, Taiwan

Meng-Jung Chuang