Advanced Semiconductor Engineering, Inc.

Meng-Jen Wang

Tsung-Yueh Tsai

Chien Cheng Liu

Chih-Ming Hung

Jen-Kai Ou

Hsueh-Te Wang

Chi-Hao Chiu

Chien-Yuan Tseng

Chi-Tsung Chiu

Chen-Tsung Chang

Cheng-Han Li

Chih-Fang Wang

Hung Chen Kuo

Chien-Hao Chen

An-Chi Tsao

Per-Ju Chao

Shang-Ruei Wu

Yu-Fang Tsai

Ying-Te Ou

Kuo-Pin Yang

Chung-Hsi Wu

Meng-Jung Chuang

Wen Jin Huang

Wei Da Lin

Chien-Yu Chen

Wei-Chung Wang

Chih-Ming Chung

Kuo-Chung Yee

Chi-Chih Shen

Jen-Chuan Chen

Wei-Min Hsiao

Yu-Wen Chen

Hui-Ying Hsieh

Hui-Shan Chang

Tai-Yuan Huang

Hui Hua Lee

Sheng-Yang Peng

Tsu-Hsiu Wu

Jiunn Chen

Chun Ko

Bing-Hong Cheng

Tsan-Sheng Huang

Sheng-Tai Tsai

Ying-Hao Wei

Yuan-Long Chiao

Jung-Liang Yeh

Chia-Feng Hsu

Cheng-Hsi Chuang

A semiconductor device package includes a substrate, a connection structure, a first package body and a first electronic component. The substrate has a first surface and a second surface opposite to the first surface. The connection structure is disposed on the firs surface of the substrate. The first package body is disposed on the first surface of the substrate. The first package body covers the connection structure and exposes a portion of the connection structure. The first electronic component is disposed on the first package body and in contact with the portion of the connection structure exposed by the first package body.

Semiconductor device package

A semiconductor device includes: a substrate having a first surface and a second surface opposite to the first surface; an electronic component disposed on the first surface of the substrate; a sensor disposed adjacent to the second surface of the substrate; an electrical contact disposed on the first surface of the substrate; and a package body exposing a portion of the electrical contact.

Semiconductor device package and method for manufacturing the same

A semiconductor device package includes a substrate having a surface, a conductive element disposed on the surface of the substrate, and an encapsulant disposed on the surface of the substrate and covering the conductive element. The conductive element has an upper surface facing away from the substrate and exposed from the encapsulant. Further, a roughness of the upper surface of the conductive element is greater than a roughness of a side surface of the conductive element.

Semiconductor device package and method of manufacturing the same

An optical device package comprises a carrier having a first surface and a second surface recessed with respect to the first surface and a lid disposed on the second surface of the carrier.

Optical device package with compatible lid and carrier

A selective EMI shielding structure for a semiconductor package and a method of fabrication thereof is disclosed. The semiconductor package, comprising: a substrate having a first face; at least one first electronic component mounted adjacent to a first region of the first face; a least one second electronic component mounted adjacent to a second region of the first face; and an encapsulant disposed over the first and the second electronic components, wherein the encapsulant covers directly over the first electronic component, and wherein the encapsulant covers the second electronic component through a layer of conductive material.

Semiconductor package shielding structure

A package structure is provided. The package structure includes a substrate, a sensor device, an encapsulant and a signal blocking structure. The substrate has a signal passing area. The sensor device is disposed over the substrate. The sensor device has a first surface, a second surface opposite to the first surface and a sensing area located at the second surface. The second surface of the sensor device faces the substrate. The encapsulant covers the sensor device and the substrate. The signal blocking structure extends from the substrate into the encapsulant.

Package structure and method for manufacturing the same

Optical device package

A semiconductor device package includes a substrate, a connection structure, a first package body and a first electronic component. The substrate has a first surface and a second surface opposite to the first surface. The connection structure is disposed on the first surface of the substrate. The first package body is disposed on the first surface of the substrate. The first package body covers the connection structure and exposes a portion of the connection structure. The first electronic component is disposed on the first package body and in contact with the portion of the connection structure exposed from the first package body.

An electronic device includes a piezoelectric module, a sensing module and a buffer element. The piezoelectric module includes a substrate and a piezoelectric element. The substrate defines an opening penetrating the substrate. The piezoelectric element is disposed on the substrate and across the opening of the substrate. The sensing module is disposed over the piezoelectric module. The buffer element is disposed between the piezoelectric module and the sensing module.

Semiconductor package device

A surface mount structure includes a substrate, a sensor, an electrical contact and a package body. The substrate has a first surface and a second surface opposite to the first surface. The sensor is disposed adjacent to the second surface of the substrate. The electrical contact is disposed on the first surface of the substrate. The package body covers the first surface and the second surface of the substrate, a portion of the sensor and a first portion of the electrical contact.

A surface mount structure comprises a redistribution structure, an electrical connection and an encapsulant. The redistribution structure has a first surface and a second surface opposite the first surface. The electrical connection is on the first surface of the redistribution structure. The encapsulant encapsulates the first surface of the redistribution structure and the electrical connection. A portion of the electrical connection is exposed by the encapsulant.

Fan-out ball grid array package structure and process for manufacturing the same

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Kaohsiung, Taiwan

Meng-Jen Wang