Siliconware Precision Industries Co., Ltd.

Meng-Hung Yeh

Yude Chu

Wei-Sheng Lin

Lung-Tang Hung

Lien-Chen Chiang

Zhi-Lun Hsieh

A method of eliminating a defective bonding wire is provided, including moving a bonding member from a first region of a carrier to a second region of the carrier if the bonding wire of the bonding member is defective, and cooperatively operating a movement member and the bonding member so as to cause the defective bonding wire to be removed from the bonding member and bonded to the second region of the carrier, thereby auto-debugging the bonding member and improving the production efficiency.

Wire bonding device and method of eliminating defective bonding wire

A method for fabricating a wire bonding structure is disclosed, which includes: providing a substrate having a plurality of bonding pads; and foaming a ball end of a bonding wire on at least one of the bonding pads by performing a scrubbing process along a path around a periphery of the bonding pad, thereby preventing delamination of the ball end of small size from the bonding pad.

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Taichung, Taiwan

Meng-Hung Yeh