Prologium Holding Inc.

Prologium Technology Co., Ltd.

Foxconn Advanced Technology Inc.

Meng-Hung Wu

Szu-Nan Yang

Hsiao-Chun Huang

Cheng-Hsien Lin

Chun-Ta Huang

Tso-Hung Yeh

Chin-Liang Liu

Wen-Xin Fei

Chin-liang Liu

Wen-xin Fei

The invention provides a soft pack battery module and its electricity supply thereof. The battery units, which are independent and complete modules, are utilized to be contacted to each other to form the battery cell with the serial connection, the parallel connection or both. There only have charges transferred rather than electrochemical reactions occurred between the battery units. Also, the metallized plastic film package is utilized to pack the battery cell. The inner electrically-conductive area of the metallized plastic film package is directly contacted to the electric power outputs of the battery cell to form electrical connections. Therefore, the problems caused by the need for additional wires can be avoided and the surface area the current path of the battery cell can be maximized.

Soft pack battery module and its electricity supply thereof

The invention provides a battery module with cooling cartridge and battery system thereof. The cooling cartridge is utilized to be disposed between the battery units stacked in a single axis. The supporting portion of the cooling cartridge is directly contacted in a large area to the current collecting sheet of the battery unit. And the wing portions, extended from the two sides of the supporting portion, are directly contacted to the inner sidewalls of the metal housing. Therefore, a large-area heat dissipating path for the battery cell is provided, and the performance and stability of the battery cell are greatly improved.

Battery module with cooling cartridge and battery system thereof

The present application provides a package structure for a chemical system, which comprises an inner glue frame and a first outer glue frame. The inner glue frame forms an accommodating space for accommodating a chemical system. The first outer glue frame is further disposed outside the inner glue frame and used for isolating the ambient environment and thus avoiding the influence of the ambient environment on the chemical system. A second outer glue frame is further disposed for avoiding damages such as side bumps and falls of the chemical system or contact with foreign metals. Thereby, the performance of the chemical system can be maintained.

Package structure for chemical system

A method for manufacturing a hollowed printed circuit board includes steps of: providing an electrically conductive layer; laminating a first dielectric layer having a first through opening defined therein on a first surface of the electrically conductive layer; forming a protecting layer on the first surface of the electrically conductive layer in the first opening; creating an electrically conductive pattern in the conductive layer; removing the protecting layer; and laminating a second dielectric layer having a second through opening defined therein on an opposite second surface of the electrically conductive layer in a manner that the first through opening is aligned with the second through opening, thereby a portion of the electrically conductive layer is exposed to exterior through the first through opening and the second through opening.

Method for manufacturing printed circuit board

An exemplary legend printing stencil for printing a circuit substrate for manufacturing a number of printed circuit board is provided. The stencil includes at least a first printing portion, at least a second printing portion and a junction portion between the first printing portion and the second printing portion. The first printing portion and the second printing portion each define a number of legend holes therein. The first printing portion and the second portion are configured for attaching on and covering the corresponding circuit board unit of the circuit substrate to print legends on the circuit board unit. The junction portion defines a slot therein and is configured for attaching on and covering the corresponding connection portion of the circuit substrate to print a legend ink layer on the connection portion. A method for manufacturing a number of printed circuit boards using the stencil is also provided.

Growing community of inventors

Taoyuan, Taiwan

Meng-Hung Wu