Lite-on Technology Corporation

Silitek Electronic (guangzhou) Co., Ltd.

Lite-on Electronics (guangzhou) Limited

Meng-Hsin Kuo

Chia-Hsi Tsai

Cheng-Te Tseng

Tzu-Kan Chen

Yi-Ting Lin

Jin-Chern Chiou

Yung-Jiun Lin

A display device is applied to a light sensing system. The display device includes a display module and a pattern layer. The pattern layer is made of optical material capable of either fully or partially reflecting or absorbing invisible light of specific wavelength emitted from the display module, and is formatted on the display module, thus defining gaps through which invisible light can pass. A light sensor is utilized to sense the pre-determined pattern defined by the invisible light passing through the pattern layer. Based on the light sensing result, the light sensor can recognize the corresponding pattern. The optical material of the pattern layer may be arranged to incorporate locational varying invisible light transmittance to define the pre-determined pattern at a finer degree, thus further increasing sensing accuracy.

Display device and light sensing system

A display device is applied to a light sensing system. The display device includes a display module and a pattern layer. The pattern layer is made of optical material and formatted on the display module. The pattern layer includes patterned optical material and gaps without optical material. The pattern layer selectively reflects or absorbs invisible light with specific wavelength emitted from the display module, such that a light sensor cannot sense the invisible light reflected or absorbed by the optical material or just can sense a little invisible light through the optical material. However, the invisible light can be emitted out of the gaps without the optical material, such that the light sensor can selectively sense the invisible light. Based on the light sensing result, the light sensor can recognize the corresponding pattern.

A lens module includes a base, and first and second lens units. The base defines a receiving space, and has two spaced-apart through holes for fluid communication of the receiving space with an area external to the base. The first lens unit is disposed within the receiving space, and defines a first light communicating path that corresponds in position to one of the through holes. The second lens unit is disposed within the receiving space in a side-by-side manner with the first lens unit, and defines a second light communicating path that corresponds in position to the other one of the through holes.

Lens module

The optical image stabilizer includes a substrate, a carrier movably disposed above the substrate for carrying an image sensor, an anchor fixed above the substrate, a conducting pad fixed above the anchor for coupling an image processing circuit, a flexible suspension disposed between the conducting pad and the carrier, a conducting line disposed above the flexible suspension coupled to the conducting pad and protruding over the carrier for coupling the image sensor, and a micro-actuator disposed between the substrate and the carrier for adjusting the position of the carrier according to control signals from an actuator control circuit.

Micro-optical image stabilizer

An image capturing device includes a base formed with a first receiving space defined by a bottom wall and a first surrounding wall, and a second receiving space defined by a top side of the first surrounding wall and a second surrounding wall. A lens module is mounted on the base for generating an optical image of an object. An auto-focusing module is disposed in the second receiving space for auto-focusing the optical image based on an external voltage. A sensing module is mounted in the first receiving space and on the bottom wall of the base, is disposed under the auto-focusing module, and is spaced apart from the lens module at a predetermined distance for sensing the optical image focused by the auto-focusing module so as to generate an electrical output corresponding to the optical image.

Image capturing device

The present invention provides a manufacturing method for a wafer lens module including the steps of providing a plastic material with high thermal resistance, wherein the high temperature plastic material can be used at a reflow temperature above 250&#x25a1;; and forming the high temperature plastic material into a wafer lens module integrally. The method can form an integrated wafer lens module and simplify the manufacturing procedures. Furthermore, a wafer lens unit formed by stacking another wafer lens module on the wafer lens module manufactured by the method can have improved optical image quality.

Manufacturing method for a wafer lens module and the structure thereof

A camera module includes a lens barrel, a lens, a sensing element, and an electromagnetic shield. The lens barrel defines a receiving space. The lens is mounted in the receiving space. The sensing element is covered by the lens barrel, is disposed below the lens, and is spaced apart from the lens. The sensing element includes a top face, a bottom face, a side face extending between the top and bottom faces, a plurality of first conductors mounted on the bottom face, at least one second conductor mounted on one of the top, bottom, and side faces, and a grounding element having one end connected to one of the first conductors and the other end connected to the second conductor. The electromagnetic shield is coupled to the lens barrel and includes a grounding portion electrically connected to the second conductor.

Camera module and method for making the same

A method for making a camera module includes the steps of: (a) providing a mold with a mold cavity; (b) mounting at least a sensing element and a lens within the mold cavity in such a manner that the sensing element and the lens are spaced apart from each other; and (c) forming a camera barrel by injecting a molding material into the mold cavity and by molding the molding material over the sensing element and the lens.

Growing community of inventors

Taipei, Taiwan

Meng-Hsin Kuo