Camtek Ltd.

Other

Menachem Regensburger

Yuri Postolov

Shimon Koren

Zehava Ben-Ezer

Moshe Edri

Mordi Dahan

Carmel Yehuda Drillman

Baheej Bathish

Gilad Golan

Zehava Ben Ezer

Tomer Gilad

Michael Lev

Daniel Buzaglo

Eldad Langmans

Uri Weinar

Eldad Langmatz

Shy Shapira

Yacov Manilovich

A semiconductor inspection tool system is disclosed. The system comprises a first illumination setup for generating at least one first illumination radiation and for directing the at least one first illumination radiation to at least one bonding region non-filled volume formed between two layers of a multi-layer stack. The system also comprises a second illumination setup being for generating at least one second illumination radiation and for directing the at least one second illumination radiation at multi-layer stack edges. The second illumination radiation is configured for illuminating at least a normal edge of at least two layers, the second illumination setup has different radiation parameters than the first illumination setup. The system further includes a bonding region sensor unit for collecting reflected electromagnetic radiation from a bonding region volume and generating at least one sensing data being indicative of the bonding region.

Semiconductor inspection tool system and method for wafer edge inspection

A method for automatic defect classification, the method may include (i) acquiring, by a first camera, at least one first image of at least one area of an object; (ii) processing the at least one first image to detect a group of suspected defects within the at least one area; (iii) performing a first classification process for initially classifying the group of suspected defects; (iii) determining whether a first subgroup of the suspected defects requires additional information from a second camera for a completion of a classification; (iv) when determining that the first subgroup of the suspected defects requires additional information from the second camera then: (a) acquiring second images, by the second camera, of the first subgroup of the suspected defects; and (b) performing a second classification process for classifying the first subgroup of suspected defects.

Automatic defect classification

There may be provided a method for evaluating an object, that may include evaluating a region of the object by a first evaluation module to provide first evaluation results that are related to multiple sites of the region; finding, using a mapping between values of first evaluation results and values of second evaluation results, (a) a first site of the multiple sites that does not require an evaluation by a second evaluation module, and (b) a second site of the multiple sites that requires an evaluation by the second evaluation module; wherein the second evaluation module is more reliable than the first evaluation module; evaluating the second site by the second evaluation module to provide second evaluation results of the second sites; estimating, based on first evaluation results of the first site and on the mapping, a state of the first site; and providing an evaluation of the region based on the state of the first site, and on the second evaluation result of the second site.

Hierarchical wafer inspection

An inspection system for inspecting a semiconductor substrate, the inspection system may include an inspection unit that comprises a partially blocking bright field unit and a non-blocking bright field unit; wherein the partially blocking bright field unit is configured to block any specular reflection that fulfills the following: (a) the specular reflection is caused by illuminating, along a first axis, of an area of the wafer, (b) the specular reflection propagates along a second axis, (c) the first axis and the second axis are symmetrical about a normal to the area of the wafer, and (d) the normal is parallel to an optical axis of the partially blocking bright field unit; and wherein the non-blocking bright field unit is configured to pass to the image plane any specular reflection that fulfills the following: (a) the specular reflection is caused by illuminating, along the first axis, of an area of the wafer, (b) the specular reflection propagates along the second axis, (c) the first axis and the second axis are symmetrical about the normal, and (d) the normal is parallel to the optical axis of the partially blocking bright field unit.

Objective lens

An inspection system that may include a motion device, for supporting an inspected object and for moving the inspected object, in response to motion device triggering signals, by a movement that is characterized by speed variations; a signal generator, for generating camera triggering signals and motion device location triggering signals; a motion device location generator, for providing location information indicative of locations of the stage at points of time that are determined by the motion device location triggering signals; a continuous illuminator for continuously illuminating areas of the inspected object; and a camera for acquiring images of areas of the inspected object in response to the camera triggering signals.

Continuous light inspection

An inspection system and a method for inspecting a diced wafer. The method includes: acquiring multiple images of multiple portions of the diced wafer according to a predefined image acquisition scheme; locating multiple unique features within the multiple images; and assigning a die index to each die of the multiple dice and associating between the multiple dice and multiple reference dice in response to locations of the multiple unique features and to at least one expected die dimension.

Inspection system and a method for inspecting a diced wafer

A method for inspecting a group of dies of a wafer, wherein the wafer comprises a group of wafer segments, wherein each wafer segment comprises a die of the group of dies, a molded material that surrounds the die and redistribution layer (RDL) conductors that are coupled to the die and are positioned above the die and the molded material, wherein the method includes the steps of: receiving design information about the RDL conductors of each wafer segment of the group of wafer segments; obtaining, during a setup process, first images of the group of wafer segments; wherein the obtaining of the first images comprises illuminating the group of wafer segments with radiation and detecting radiation scattered or reflected from the group of wafer segments as a result of the illuminating; generating reference information based on the design information about the RDL conductors of one or more wafer segments of the group of wafer segments and at least one first image of the one or more first images; acquiring, during an inspection process, a second image of each wafer segment of the group of wafer segments; and evaluating each wafer segment of the group of wafer segments based on the second image of the wafer segment and the reference information of the wafer segment.

Inspecting a wafer using image and design information

A triangulation system comprising an area camera, a communication interface, a first image processing module, a second image processing module; wherein the area camera is arranged to obtain, at an acquisition rate, a stream of images of illuminated regions of an object; wherein the area camera is prevented from performing height calculations; wherein the communication interface is arranged to convey, in real time thereby in correspondence to the acquisition rate, the stream of images from the area camera to the first image processing module; wherein the first image processing module is arranged to process, in real time, the stream of images to provide first compressed information; wherein the second image processing module is arranged to process, at a non-real time image processing rate, the first compressed information to provide height information indicative of heights of at least the illuminated regions of the object.

High throughput and low cost height triangulation system and method

System, computer readable medium and method. The system includes (i) a data obtaining module arranged to obtain data about at least one portion of an inspected article; and (ii) a processor arranged to perform at least one processing operation of the data out of: (a) processing the data to provide the inspection recipe; and (b) processing the data, while utilizing the inspection recipe, to detect defects; wherein the inspection recipe comprises multiple zones of multiple types of zones; wherein a zone of a first type of zones differs from a zone of a second type of zone.

Inspection recipe generation and inspection based on an inspection recipe

Method and inspection system. The inspection system includes: (i) a stage, for supporting an inspected object and for moving the inspected object by a movement that is characterized by speed variations; (ii) a signal generator, for generating triggering pulses at a fixed frequency regardless of the speed variations; (iii) a stage location generator, for providing location information indicative of a location of the stage at points of time that are determined by the triggering pulses; (iv) a strobe illuminator for illuminating areas of the inspected object in response to the triggering pulses; (v) a camera for acquiring images of areas of the inspected object in response to the triggering pulses; wherein overlaps between the images of the areas of the inspected object are characterized by overlap variations; and (vi) a processor for associating location information to the acquired images.

System and method for inspection

A method for inspecting objects and an inspection system, the system includes: an image acquisition unit adapted to acquire multiple images, according to a predefined image acquisition scheme, of multiple portions of a diced wafer that comprises multiple dice; and a processor adapted to locate multiple unique features within the multiple images, at least partially during the acquisition of images; associate multiple unique features with multiple dice, at least partially during the location of multiple unique features; determine multiple transformations between multiple die coordinate systems and a global coordinate system, in response to a locations of unique features and their associations with multiple dice, at least partially during an association between multiple unique features with multiple dice; and detect defects in response to a comparison between dice and corresponding reference dice, in response to the transformations, at least partially during the determination of the multiple transformations.

Inspection system and a method for detecting defects based upon a reference frame

A wafer inspection system and a method for inspecting a wafer. The method includes: acquiring multiple frames that cover a first area that comprises a die and a first surrounding area that surrounds the die; wherein the frames partially overlap to provide overlap areas; and processing a sequence of decomposed images of overlap areas such as to align mutually misaligned frames and generating a die reference image.

A method for inspecting a diced object that comprises multiple dies, the method includes: acquiring multiple images of multiple portions of the diced object, starting from a first portion that comprises an alignment area and continuing through adjacent portions of the diced object; assigning a die index to each die of the multiple dies of the diced object, starting from a die of the first portion and continuing through adjacent portions of the diced object; associating between dies of the diced object and a dies of a reference object in response to the assigned indexes and locations of the dies of the diced object; wherein the reference object is not diced; and comparing between a die of the diced object and another die while taking into account an association between the die of the diced object and a reference object die.

Method and system for inspecting a diced wafer

A method and a system for establishing a wafer testing recipe are disclosed. The method may include acquiring images of a number of dice from a produced wafer; using at least part of the images to compose a reference-image; defining on the reference-image multiple 'zones of interest; determining the Detection-Policy for each kind of zone of interest and determining the algorithm that will be used by each of the Detection-Policy; determining the parameters of each of the Detection-Policy's algorithms; determining the Reporting-policy; determining the Inspection-policy; and creating a 'wafer testing recipe' by integrating of the testing reference of a typical die image, the zones of interest, the Detection-Policies, the parameters of the Detection-Policies' algorithms, the Reporting-Policies and the Inspection-Policies.

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Menachem Regensburger