E.i. Dupont De Nemours and Company

International Business Machines Corporation

Merck Patent Gmbh

Dsm IP Assets B.v.

Hitachi Chemical Dupont Microsystems, Ltd.

Hitachi Chemicial Dupont Microsystems, L.l.c.

Melvin P Zussman

Brian C Auman

Edgar Bohm

Paul Stephen Andry

Cornelia K Tsang

Sarah Huffsmith Knickerbocker

Paulus Antonius Maria Steeman

Marco Marcus Matheus Driessen

Bernd Fiebranz

Debra Lynn Fish Repko

Ron R Legario

Birol Kirayoglu

Beert Jacobus Keestra

Edgar B&ouml;hm

Beert Jacobs Keestra

Akio Osabe

William J Sillivan

The invention relates to a radiation curable resin composition comprising a cationically polymerizable component, a cationic photoinitiator, a hydroxy component, an impact modifier and wherein the resin composition after full cure has a modulus of &#x3e;2 GPa; a yield stress &#x3c;70 MPa; and a Kvalue &#x3e;1.3 MPa&#xb7;(m)or an Izod value &#x3e;0.45 J/cm. The resin composition can preferably be used in the preparation of three dimensional objects.

Radiation curable resin composition and rapid three dimensional imaging process using the same

A method of forming an integrated circuit assembly includes forming an insulator layer on a preliminary semiconductor assembly. The preliminary semiconductor assembly includes a semiconductor substrate having a first side and a second side opposite the first side, a semiconductor circuitry layer formed on the first side of the semiconductor substrate, and a conductive via extending through the semiconductor substrate from the semiconductor circuitry layer to the second side. The insulator is formed on the second side and an end of the conductive via. The method includes forming a polymer layer on the insulator layer, removing a quantity of the polymer layer sufficient to expose the end of the conductive via through the insulator layer, and forming a conductive contact on the polymer layer and the end of the conductive via.

Integrated circuit assembly with cushion polymer layer

The present invention relates to polyimide photo alignment films for liquid crystal display devices comprising an aromatic tetracarboxylic dianhydride component containing 3,3&prime;,4,4&prime;-benzophenone tetracarboxylic dianhydride and an aromatic diamine component containing at least one diamine of the group of fofmulae AI to AIII as given in the text. Further display devices and methods of their fabrication employing a photo alignment process are disclosed.

Polymide photo alignment film from 3,3&prime;,4,4&prime;-benzophenone tetracarboxylic dianhydride and ortho-substituted aromatic diamines for liquid crystal displays

The present invention relates to polyimide photo alignment films for liquid crystal display devices comprising an aromatic tetracarboxylic dianhydride component containing 3,3',4,4'-benzophenone tetracarboxylic dianhydride and an aromatic diamine component containing at least one diamine of the group of formulae AI to AIII as given in the text. Further display devices and methods of their fabrication employing a photo alignment process are disclosed.

Polyimide photo alignment film from 3,3,4,4-benzophenone tetracarboxylic

The present invention provides a STN LCD device having at least two domains per pixel, comprising:

Multi-domain STN LCD comprising fluorinated polyimide alignment layers

A poly(2,6-piperazinedione) liquid crystal alignment film providing high voltage holding ratio and high tilt angle when used in active matrix and super twisted nematic liquid crystal displays.

Poly(2,6-piperazinedione) alignment layer for liquid crystal displays

Dimensionally stable resin impregnated laminates for printed wiring board applications are reinforced with from 43 to 57 weight percent of nonwoven aramid sheet having a coefficient of thermal expansion of less than 10 ppm per .degree. C, a basis weight of from 0.8 to 4.0 oz/yd.sup.2, a density of from 0.5 to 1.0 g/cc and a Gurley Hill Porosity of less than 10 sec.

Resin impregnated laminate for wiring board applications

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Wilmington, DE, United States of America

Melvin P Zussman