Lockheed Martin Corporation

Melissa A Grette

Kevin J Thorson

Gregory M Drexler

An electronics component assembly for cooling high power density components including a fluid cooled module cover. In one embodiment, the electronics component assembly includes a module cover that is configured to make thermal contact with heat-generating electronic components of a module. The module cover includes an inlet, an outlet and at least one fluid passageway between the inlet and the outlet. The fluid passageway permits fluid to flow through the module cover, thereby allowing the module cover to act as a heat sink.

Growing community of inventors

Eagan, MN, United States of America

Melissa A Grette