Panduit Corporation

Melanie M Hagar

Frank M Straka

Satish I Patel

Robert E Fransen

Masud Bolouri-Saransar

Ronald Alex Nordin

Embodiments of the present invention generally relate to communication connectors, and methods of manufacture thereof and their components. In some embodiments, the methods focus on reducing the net effect on electrical performance of communication connectors from variation in manufacturing, where the connectors include multiple stages of capacitive coupling.

Methods of manufacture of communication connectors and communication connector circuits

A communication connector comprising plug interface contacts having a plurality of conductor pairs, and corresponding cable connector contacts. A printed circuit board connects the plug interface contacts to respective cable connector contacts. The printed circuit board includes circuitry between a first conductor pair and a second conductor pair. The circuitry has a first mutually inductive coupling between a first conductor of the first conductor pair and a first conductor of the second conductor pair, a first capacitive coupling between the first conductor of the first conductor pair and the first conductor of the second conductor pair. The first capacitive coupling is approximately concurrent with the first mutually inductive coupling. A shunt capacitive coupling connects the first conductor of the second conductor pair to a second conductor of the second conductor pair.

Communication connector with crosstalk compensation

A communication jack which includes a housing with an aperture for receiving a communication plug, and a circuit board at least partially within the housing. The circuit board includes crosstalk compensation elements. A plurality of plug interface contacts are connected to the circuit board. At least one of the plurality of plug interface contacts includes a contact element layered with at least one spring element.

Growing community of inventors

Park Forest, IL, United States of America

Melanie M Hagar