Qualcomm Incorporated

Melanie Dolores Oclima

Kwangyoon Lee

Adam Cunningham

Jon James Anderson

Ronald Alton

Heekab Shin

Henri Begin

Kai Yee Wan

Various aspects of the present disclosure include methods, components and wireless devices configured to determine appropriate generalized system-wide thermal management policies and settings in wireless devices depending upon whether communication activities are driving or otherwise causing thermal conditions. In various aspects, a processor may determine workload characteristics and select and apply an appropriate thermal management policy/solution (or thermal configuration, settings etc.) based on the determine workload characteristics. The processor may determine workload characteristics based upon data from two or more temperature sensors within the wireless device. The processor may select a generalized system-wide thermal management policy suitable for operating when communication activities (e.g., 5G communication activities) are generating so much heat that CPU-centric thermal management policies are in appropriate.

Systems and methods of dynamic thermal management for enhancing thermal performance in 5G enabled devices

Various embodiments of systems and methods are disclosed for determining a thermal power envelope. One method comprises determining a set of component and operating point combinations for a plurality of components in a portable computing device. Each component and operating point combination in the set defines an available operating point for each of the plurality of components. The portable computing device is iteratively set to each of the component and operating point combinations in the set. At each of the component and operating point combinations, power consumption data and skin temperature data is collected from a plurality of temperature sensors. An enhanced thermal power envelope is generated comprising the power consumption data and the skin temperature data for each of the component and operating point combinations.

Systems and methods for determining a sustained thermal power envelope comprising multiple heat sources

Systems, methods, and computer programs are disclosed for providing optimal power/performance thermal mitigation in a portable computing device having a plurality of processing cores. An exemplary method comprises storing a power sweep table defining a power consumption value for each of a plurality of core frequency and core count combinations for an integrated circuit having a plurality of processing cores. A search table is generated by filtering the power sweep table based on one or more configuration parameters associated with the integrated circuit. A target power level is selected to sustain a thermal power envelope for the integrated circuit. The search table is traversed to find one of the plurality of core frequency and core count combinations having a corresponding power consumption value that matches the target power level.

Core frequency/count decision-based thermal mitigation optimization for a multi-core integrated circuit

Various embodiments of methods and systems for intelligent thermal power management implemented in a portable computing device ('PCD') are disclosed. To mitigate or alleviate hysteresis associated with drastic changes in processing speeds for thermally aggressive processing components, embodiments of the solution dynamically adjust performance level floors in view of a temperature reading. Advantageously, embodiments work to manage thermal energy generation based on temperature sensor feedback that is relatively slow to detect temperature changes.

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San Diego, CA, United States of America

Melanie Dolores Oclima