Google Inc.

Melanie Beauchemin

Madhusudan K Iyengar

Zuowei Shen

Christopher Gregory Malone

Ryohei Urata

Woon-Seong Kwon

Michael Chi Kin Lau

Federico Pio Centola

Norman Paul Jouppi

Hong Liu

Teckgyu Kang

Gregory P Imwalle

William Frank Edwards

Emad Samadiani

Padam Jain

Connor Burgess

Timothy Conrad Lee

Yingying Wang

Justin Sishung Lee

Richard C Bruns

Kyle Fukuchi

Nicholas Stevens-Yu

Yuan Hang Li

Jamyuen Ko

Michael Honsing Lau

Shawn Emory Bender

Gregory Sizikov

Houle Gan

William F Edwards

Yujeong Shim

Jerry Chiu

Chee Yee Chung

Erji Mao

Xu Zuo

Yuan Li

Shinnosuke Yamamoto

Mark Villegas

Xu Gao

An assembly includes a printed circuit board ('PCB'). An aperture extends through the PCB. The assembly also includes an array of pins and a processor package. The array of pins extends around a perimeter of the aperture, and the processor package extends over the aperture. The processor package is pressed against the array of pins by a compressive force couple.

Structure for optimal XPU socket compression

A method of manufacturing a chip assembly comprises joining an in-process unit to a printed circuit board; reflowing a bonding material disposed between and electrically connecting the in-process unit with the printed circuit board, the bonding material having a first reflow temperature; and then joining a heat distribution device to the plurality of semiconductor chips using a thermal interface material ('TIM') having a second reflow temperature that is lower than the first reflow temperature. The in-process unit further comprises a substrate having an active surface, a passive surface, and contacts exposed at the active surface; an interposer electrically connected to the substrate; a plurality of semiconductor chips overlying the substrate and electrically connected to the substrate through the interposer, and a stiffener overlying the substrate and having an aperture extending therethrough, the plurality of semiconductor chips being positioned within the aperture.

Methods and heat distribution devices for thermal management of chip assemblies

A data rack system includes a data center rack frame, a shelf positioned within the data center rack frame; and a modular battery unit disposed on the shelf. The modular battery unit further includes a housing having an outer surface, a plurality of strips of phase change material ('PCM') attached to the outer surface and spaced apart from one another; and air flow channels. The air flow channels are formed in spaces between two adjacent strips of the plurality of strips and defined by a shape and size of the spaces between the two adjacent strips.

Thermal management of battery units on data center racks

Heat dissipation and electric shielding techniques and apparatuses are disclosed to enable the operation of OSFP modules at higher bandwidths. OSFP compatible techniques are discussed including the use of water cooling, addition of heat pipes, use of intercoolers, air-fins and air-foils, optimization of cooling fins, use of vapor chambers are discussed.

Thermal optimizations for OSFP optical transceiver modules

The technology relates to a cage configured to removably receive a module. The cage may include a frame comprising a plurality of panels joined to one another, a lever pivotably coupled to the frame, and a heatsink pivotably coupled to the lever. The panels together may extend around a longitudinal recess configured to receive the module therein. The longitudinal recess may define a longitudinal axis thereof. A first one of the panels may have an aperture defined therein in communication with the longitudinal recess. A first end of the lever may extend into the longitudinal recess. The heatsink may be pivotably coupled to a second end of the lever opposite the first end. The heatsink may be movable in a translation direction transverse to the longitudinal axis. The heatsink may be translatable between a first position outside of the longitudinal recess and a second position partially inside the longitudinal recess.

Blind mate thermal cooling solution for small form factor pluggable transceiver

While the use of 2.5D/3D packaging technology results in a compact IC package, it also raises challenges with respect to thermal management. Integrated component packages according to the present disclosure provide a thermal management solution for 2.5D/3D IC packages that include a high-power component integrated with multiple lower-power components. The thermal solution provided by the present disclosure includes a mix of passive cooling by traditional heatsink or cold plate and active cooling by thermoelectric cooling (TEC) elements. Certain methods according to the present disclosure include controlling a temperature during normal operation in an IC package that includes a plurality of lower-power components located adjacent to a high-power component in which the high-power component generates a greater amount of heat relative to each of the lower-power components during normal operation.

Thermoelectric cooler (TEC) for spot cooling of 2.5D/3D IC packages

An electromagnetic interference ('EMI') sheet attenuator includes a planar conductive layer, a first flexible substrate and a second flexible substrate. The first flexible substrate overlies the metal backing layer and including a conductive pattern on a surface of the first flexible substrate. The second flexible substrate overlies the first flexible substrate and also includes the conductive pattern. The conductive pattern on the second flexible substrate is aligned with the conductive pattern on the first flexible substrate.

Electromagnetic interference ('EMI') sheet attenuators

The present disclosure discusses an improved optical transceiver. The optical transceiver of the present disclosure includes an optical transmitter and an optical receiver coupled to an area of a printed circuit board that includes a plurality of thermal microvias. The thermal microvias are coupled to a heat sink or other heat dissipater and provide a path from the components of the optical transceiver to the heat dissipater for heat to travel.

Heat dissipation approach in chip on board assembly by using stacked copper Microvias

Heat dissipation approach in chip on board assembly by using stacked copper microvias

The present disclosure discusses an improved optical transceiver. The optical transceiver of the present disclosure includes an optical transmitter and an optical receiver that are spatially separated. In some implementations, the optical receiver and optical transmitter are staggered from one another. Each of the optical receiver and the optical transmitter and housed within a separate optical lens. In some implementations, the separation of the components reduces mechanical, thermal, and electrical cross talk between the optical transmitter and the optical receiver. The separation of the components can also ease the constraints of the optical alignment between the optical transmitter and the optical receiver and each of their respective lenses.

Optical transceiver having separate transmitter and receiver lenses

Systems and methods for reducing temperature of an optical signal source co-packaged with a driver are provided. An optical transmitter can include a housing. The optical transmitter can include an optical signal source positioned within the housing. The optical transmitter can include a signal source driver positioned within the housing and configured to control an output of the optical signal source. The optical transmitter can include a substrate mounted on an interior surface of the housing and having a microwave waveguide coupled to it. The microwave waveguide can be configured to direct electrical signals originating outside the housing to the signal source driver. The substrate is can also be configured to limit heat transfer from the signal source driver to the optical signal source.

Systems and methods for reducing temperature in an optical signal source co-packaged with a driver

A server rack sub-assembly includes at least one motherboard having a perimeter; a plurality of heat-generating electronic devices mounted on the motherboard in an area of the motherboard thermally decoupled from the motherboard perimeter; one or more brackets including heat transfer surfaces and attached to the motherboard along at least a portion of the motherboard perimeter; and a heat transfer device thermally coupled to the area of the motherboard that is thermally decoupled from the motherboard perimeter and the one or more brackets. The one or more brackets are adapted to receive a cooling airflow circulated over the bracket and to convectively transfer heat into the cooling airflow and are further adapted to couple the motherboard to a server rack assembly. The heat transfer device is arranged to conductively transfer heat from the one or more electronic devices to the brackets.

Cooling heat-generating electronics

Growing community of inventors

Mountain View, CA, United States of America

Melanie Beauchemin