Nippon Telegraph and Telephone Corporation

Meishin Chin

Shigeru Kanazawa

Takahiko Shindo

Takashi Sakamoto

Masahiro Ueno

Seiji Toyoda

Yuichi Akage

Tadashi Sakamoto

Joji Yamaguchi

Yuzo Sasaki

Shoko Tatsumi

Naoki Fujiwara

Yuta Ueda

An optical semiconductor chip of the present disclosure includes a high frequency line between an electrode pad receiving a modulation signal and a modulation electrode on the optical waveguide having a light absorption layer. The depletion layer capacitance generated in the light absorption layer is canceled by an inductor component of the high frequency line. When a portion directly below the high frequency line is embedded with a low-dielectric-constant material or is made hollow, the parasitic capacitance is further reduced. The high frequency line may have a zigzag shape as well as a linear shape. The electrode pad on the optical semiconductor chip can be connected to other substrates including RF lines for modulation signal input by bumps or wire bonding.

Optical semiconductor chip

In the present disclosure, in an EADFB laser in which an SOA has been integrated, a new configuration in which a problem of deterioration of optical waveform quality and insufficient optical output is solved or mitigated while taking advantage of characteristics that the same layer structure can be used and a manufacturing process can be simplified is shown. In an optical transmitter of the present disclosure, a waveguide structure having different core widths (waveguide widths) is adopted while using the same layer structure for a DFB laser and the SOA. Waveguides with different core widths are adopted so that a problem of insufficient saturated optical output or waveform deterioration due to a pattern effect is solved and mitigated. A passive waveguide region having a tapered shape is introduced in a part between an EA modulator and the SOA so that a waveguide width is continuously changed.

Optical transmitter

Provided is a semiconductor light source element or an optical device including a semiconductor optical waveguide of a high-mesa semi-insulated embedded structure having a window structure made of the same material as an overclad layer at a light emission end, and a method for manufacturing thereof, in which an active layer at a portion of the window structure is removed, and then the same layer as the overclad layer is formed.

Method for manufacturing optical semiconductor waveguide window structure

In an EADFB laser with an integrated SOA, a new configuration in which deterioration of optical waveform quality is solved or mitigated while taking advantage of characteristics that the same layer structure can be used and the manufacturing process can be simplified is shown. In an optical transmitter of the present disclosure, a carrier density is optimized depending on a light intensity inside the SOA and an amount of carrier consumption. The SOA is electrically separated into a plurality of regions, and a current is injected into each region independently. The divided SOA region is configured so that a length of the SOA region becomes shorter as a region is farther from an incidence end of the SOA. Further, for the divided SOA, an amount of carrier consumption increases as the SOA region is farther from the incidence end, so that a current injection amount is increased.

There is provided a highly convenient package for an optical module in which a device can be mounted as it is even when the number and mounting position thereof are different according to the device to be mounted. The package includes a base plate having a top surface on which devices are assembled, an optical fiber mounting component mounted on the top surface of the base plate, a direct current electrical interface component and a high frequency electrical interface component mounted on the top surface of the base plate. The optical fiber mounting component and the electrical interface components are separately manufactured, separately assembled on the top surface of the base plate, and fixed in different modes. The optical fiber mounting component is fixed by fastening with screws and fixed by soldering, and the electrical interface components are fixed by fastening with the screw.

Package for optical module

A swept light source of the present invention keeps a coherence length of an output beam long over an entire sweep wavelength range. A gain of a gain medium is changed with time in response to a wavelength sweep and the coherence length is kept maximum. The gain of the gain medium is kept close to a lasing threshold and an unsaturated gain range of the gain medium is narrowed over the entire sweep wavelength range. An SOA current waveform data acquiring method of driving while keeping the coherence length long, a novel coherence length measuring method, and an optical deflector suitable for the swept light source are also disclosed.

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Atsugi, Japan

Meishin Chin