Nanopass Technologies Ltd.

Nanopass Ltd.

Meint De Boer

Yehoshua Yeshurun

Meir Hefetz

J W Berenschot

J G E Gardeniers

Mier Hefetz

Hans Gardeniers

Erwin Berenschot

Dominique Maria Altpeter

Erwin J W Berenschot

Garrit Boom

Jw Berenschot

Jge Gardeniers

J G Gardeniers

A method for processing a wafer to form a plurality of hollow microneedles projecting from a substrate includes forming, by use of a dry etching process, a number of groups of recessed features, each including at least one slot deployed to form an open shape having an included area and at least one hole located within the included area. The internal surfaces of the holes and the slots are then coated with a protective layer. An anisotropic wet etching process is then performed in such a manner as to remove material from outside the included areas while leaving a projecting feature within each of the included areas. The protective layer is then removed to reveal the microneedles.

Microneedle structure and production method therefor

A method for producing microneedles. The method including disposing a first layer of a radiation sensitive polymer on to a working surface and selectively irradiating the first layer such that the first layer has at least one irradiated region and at least one non-irradiated region. The method also including developing the first layer so as to selectively remove one of the at least one irradiated region and the at least one non-irradiated region such that, at least part of at least one remaining region at least partially defines a form of at least part of a microneedle structure. A microneedle structure including a plurality of microneedles at least partially formed from a radiation sensitive polymer.

Polymer microneedles

Growing community of inventors

Enschede, Netherlands

Meint De Boer