Boe Technology Group Co., Ltd.

Beijing Boe Display Technology Co., Ltd.

Beijing Boe Technology Development Co., Ltd.

Meili Wang

Xue Dong

Fei Wang

Xin Gu

Xuan Liang

Fengjuan Liu

Wei Wang

Feng Zhang

Kang Guo

Renquan Gu

Xiaochuan Chen

Lei Wang

Li Ni Zhang

Qi Yao

Guangcai Yuan

Jifeng Tan

Dongfang Wang

Fuqiang Li

Liangchen Yan

Chenyang Zhang

Feng Guan

Ming Zhu

Hongda Sun

Huijuan Wang

Mengya Song

Duohui Li

Xinxin Zhao

Zhanfeng Cao

Yanling Han

Qi Qi

Yafeng Yang

Haitao Huang

Chunsheng Jiang

Jing Yu

Xuan Feng

Mingxing Wang

Lungpao Hsin

Xiandong Meng

Yun Qiu

Hua Yin Huang

Zhenhua Lv

Libo Wang

Shiyu Zhang

Detian Meng

Xiaojin Zhang

Xiaoling Xu

Yapeng Li

Dini Xie

Chinlung Liao

Yingtao Wang

Zezhou Yang

Yuanxin Du

Lung Pao Hsin

Xuyuan Li

Chin Lung Liao

Wanxian Xu

Longbao Xin

Xianbin Xu

A method for manufacturing a light field display device and a light field display device are provided, the method includes: forming a plano-concave lens layer on a substrate, and the plano-concave lens layer comprises a plurality of plano-concave lenses arranged in an array and a plurality of alignment marks arranged at preset positions; forming a first planarization layer covering the plano-concave lens layer to form a microlens array, the first planarization layer having a refractive index greater than a refractive index of the plano-concave lens layer; attaching the light-emitting side of the display panel to a side of the microlens array away from the substrate according to the alignment mark.

Method for manufacturing light field display device and light field display device

A substrate includes a base substrate, at least two bonding pads are arranged on the base substrate, the base substrate and an electronic element are bonded to each other through the at least two bonding pads, at least two pins are arranged on the electronic element, a protective layer is arranged at a side of the bonding pads away from the base substrate, and an opening region is arranged in the protective layer at each bonding pad, to expose partial surface of the bonding pad. A bonding combination layer made of a low-melting-point alloy material is arranged in the opening region, and the low-melting-point alloy material is capable of being melted at a first predetermined temperature, to enable the bonding pads and the pins to be bonded to each other.

Substrate, method for forming the same, display device and for forming the same

An optical detection apparatus and method for detecting a display panel is provided. The apparatus includes photosensitive units arranged in an array. A minimum distance between adjacent photosensitive units is less than a sub-pixel size of the display panel; the photosensitive units in adjacent rows have a position offset in a first direction; and an offset distance corresponding to the position offset is less than the sub-pixel size of the display panel.

Optical detection apparatus for detecting display panel and method for detecting display panel

A semiconductor apparatus and a method for manufacturing the semiconductor apparatus are provided. The semiconductor apparatus includes: a base substrate; a chip arranged on the base substrate, wherein the chip includes a chip main body and a plurality of terminals arranged on the chip main body; a terminal expansion layer arranged on the base substrate, the terminal expansion layer including a conductive material, and the terminal expansion layer and at least one terminal are located on a same side of the chip main body; and a plurality of expansion wires in the terminal expansion layer, wherein the plurality of expansion wires are electrically connected to the plurality of terminals, respectively, to lead out the plurality of terminals, wherein an orthographic projection of at least one expansion wire on the base substrate completely covers an orthographic projection of a terminal electrically connected to the expansion wire on the base substrate.

Semiconductor apparatus and method for manufacturing the same

A semiconductor apparatus and a method for manufacturing the semiconductor apparatus are provided. The semiconductor apparatus includes: a base substrate; a plurality of chips arranged on the base substrate each including a chip main body and a plurality of terminals arranged thereon; a plurality of fixed connection portions arranged on the base substrate, and adjacent to the plurality of chips; a terminal expansion layer arranged on the base substrate; and a plurality of expansion wires in the terminal expansion layer and configured to electrically connect the chips, wherein an expansion wire configured to electrically connect two chips includes at least a first wire segment and a second wire segment, and the first wire segment is configured to electrically connect a terminal of a chip and a fixed connection portion adjacent to the chip, and the second wire segment is configured to connect two fixed connection portions between the two chips.

Semiconductor apparatus having expansion wires for electrically connecting chips

Provided are a display substrate, a method for manufacturing a display substrate and a display apparatus. The display substrate includes a base, a drive structure layer disposed on the base, a light emitting element disposed on the drive structure layer, an encapsulation layer disposed on the light emitting element, a circular polarizer layer disposed on the encapsulation layer, and a lens definition layer and a lens structure layer disposed on the circular polarizer layer. The light emitting element includes a pixel definition layer provided with a plurality of sub-pixel openings; the lens structure layer includes a plurality of lenses disposed at intervals, the lens definition layer is disposed in a gap region between adjacent lenses, and an orthographic projection of each lens on the base contains an orthographic projection of a sub-pixel opening on the base.

Display substrate, preparation method therefor, and display apparatus

A light-emitting substrate, a method of manufacturing a light-emitting substrate, and a display device are provided. The light-emitting substrate includes: a first substrate, wherein the first substrate includes a first base substrate, a light-emitting diode arranged on the first base substrate, and a first conductive pad arranged on the first base substrate; a second substrate arranged opposite to the first substrate, wherein the second substrate includes a second base substrate, and a second conductive pad arranged on the second base substrate; and a bonding wire structure including a bonding wire, wherein the first conductive pad is located on a surface of the first substrate away from the second substrate, the second conductive pad is located on a surface of the second substrate away from the first substrate, and the bonding wire is configured to electrically connect the first conductive pad and the second conductive pad.

Light-emitting substrate, method of manufacturing light-emitting substrate, and display device

The present disclosure belongs to the field of display technology, and provides an optical module, a manufacturing method thereof, and a display device. The optical module includes: a substrate; a barrier structure arranged on the substrate; a black matrix arranged within the barrier structure, an orthogonal projection of the black matrix onto the substrate not going beyond a region surrounded by the barrier structure; and optical lenses arranged on a side of the black matrix away from the substrate. An orthogonal projection of a gap between adjacent optical lenses onto the substrate falls into the black matrix.

Optical module, manufacturing method, and display device

Embodiments of the present application disclose a method for manufacturing a naked-eye 3D device and a naked-eye 3D device. The method includes: forming a display module including a plurality of pixel islands; forming a spacer layer on the display module; and forming a micro-lens array on the spacer layer, wherein the spacer layer is formed to have a thickness such that the plurality of pixel islands are located at a focal plane of the micro-lens array. The method further includes: forming an alignment mark between the spacer layer and the display module, wherein the alignment mark is used for, when forming the micro-lens array, aligning each micro-lens in the micro-lens array with one of the plurality of pixel islands.

Method for manufacturing naked-eye 3D device, and naked-eye 3D device

The present disclosure relates to a reflective device and a display apparatus. In one embodiment, a reflective device includes: a resonant cavity configured to reflect a light of a first wavelength range; and a light conversion structure disposed within the resonant cavity and configured to convert an incident light of a second wavelength range into the light of the first wavelength range.

Reflective device and display apparatus

The present disclosure relates to the field of LED display technologies, and provides an LED chip, an LED light emitting substrate, a display device and a control method thereof. Specifically, the LED chip comprises: an N-type semiconductor layer, a P-type semiconductor layer, as well as a quantum well layer between the N-type semiconductor layer and the P-type semiconductor layer. The quantum well layer is made of indium gallium nitride, wherein indium atoms have a molar ratio of greater than or equal to 0.3 in the indium gallium nitride.

LED chip, LED light emitting substrate, display device and control method thereof

A display component includes a transflective layer, a reflective layer, and at least one sidewall. The reflective layer is arranged opposing to the transflective layer, and the at least one sidewall is arranged between the reflective layer and the transflective layer. The transflective layer, the reflective layer, and the at least one sidewall are together configured, upon an input of an incident light through the transflective layer, to output a light of a target color out through the transflective layer. One or more of the at least one sidewall comprise at least one light-conversion layer configured to emit a light of the target color upon excitement by a light of a different color shedding thereupon. The display component can be configured to output a red light, a green light, or a blue light.

Display component and display apparatus

A holographic display panel comprises a plurality of display units, each display unit comprises at least two adjacent pixels, each pixel comprises: a plurality of sub-pixels; and a plurality of phase plates. Diffractive angles of light coming out of the phase plates corresponding to the sub-pixels in a same pixel are the same, a diffractive angle of first light coming out of the phase plates corresponding to a first pixel in one of the display units is different from a diffractive angle of second light coming out of the phase plates corresponding to a second pixel that is different from the first pixel but in the same display unit, and a reverse extension line of the first light and a reverse extension line of the second light intersect at an image plane position.

Holographic display panel, holographic display device and display method therefor

A backlight includes a plurality of light sources of at least three different colors disposed on a base substrate, and a plurality of grating units that are disposed on a light exit side of the plurality of light sources and are in one-to-one correspondence with the plurality of light sources. Each of the plurality of grating units is used for splitting light emitted by a corresponding one of the plurality of light sources to form in an array of uniformly distributed monochromatic spots, so that the backlight may form an array of colored spots in which at least three different colors of light spots are alternately arranged in sequence along a first direction, wherein the first direction is a row direction or a column direction of the array of colored spots.

Backlight and liquid crystal display device

The present application discloses a method of fabricating an anti-reflective film, comprising forming a zinc oxynitride layer on a substrate; annealing the zinc oxynitride layer; and etching the surface of the zinc oxynitride layer with an etching solution to form a micro lenses layer comprising a plurality of micro lenses on surface.

Anti-reflective film, display panel and display device having the same, and fabricating method thereof

Growing community of inventors

Beijing, China

Meili Wang