Jenoptik Optical Systems Gmbh

Meik Panitz

Tobias Gnausch

Marc D Himel

Ralf Mueller

Method and device for severing a microchip from a wafer and arranging the microchip on a substrate, wherein the microchip is contact-bonded to the free end of a tip during severing and accordingly adheres to the tip through adhesive force while the substrate is transported. A coordinate measuring machine can advantageously be used as device.

Method and device for severing a microchip from a wafer and arranging the microchip on a substrate

A device and method for measuring a power density distribution of a radiation source is provided. The device includes a radiation source designed to emit a light beam in a radiation direction; a substrate disposed downstream of the radiation source in the radiation direction and having an extent in an x-direction and a y-direction, the substrate having a first region and at least one further second region, and the first region comprises a diffractive structure designed to separate the light beam impinging on the substrate into a zeroth order of diffraction and at least one first order of diffraction; and a detector unit disposed downstream of the substrate in the radiation direction and designed to measure the intensity of the first order of diffraction transmitted through the substrate and to derive a power density distribution therefrom.

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Weimar, Germany

Meik Panitz