Freescale Semiconductor,inc.

Nxp Usa, Inc.

Meijiang Song

Chu-Chung Lee

Jinzhong Yao

Tu-Anh N Tran

Xuesong Xu

Mariano Layson Ching, Jr

Chin Teck Siong

Jun Li

Yin Kheng Au

Allen Marfil Descartin

Lidong Zhang

Jia Lin Yap

John G Arthur

Matthew J Zapico

A copper lead frame used in the assembly of a semiconductor device includes a die flag and lead fingers extending away from the die flag. Each lead finger has a proximal end near the die flag and a distal end further away from the die flag. Metal plating is formed on the lead fingers, where first lead fingers have the metal plating on their proximal ends and second lead fingers have the metal plating on their distal ends. The first and second lead fingers are arranged alternately around the die flag.

Lead frame with selective patterned plating

An integrated circuit copper wire bond connection is provided having a copper ball () bonded directly to an aluminum bond pad () formed on a low-k dielectric layer () to form a bond interface structure for the copper ball characterized by a first plurality of geometric features to provide thermal cycling reliability, including an aluminum minima feature (Z1, Z2) located at an outer peripheral location () under the copper ball to prevent formation and/or propagation of cracks in the aluminum bond pad.

Copper ball bond interface structure and formation

A lead frame has multiple regions having different wetting characteristics on its surface. For example, one region is formed to handle silver plating while another has less wetting ability. A boundary between the regions causes a wetting force difference that inhibits molten solder flow between regions during solder die bonding.

Lead frame with solder flow control

Growing community of inventors

Tianjin, China

Meijiang Song