Industrial Technology Research Institute

Mei-Ru Lin

Tzong-Ming Lee

Jing-Yi Yan

Shu-Tang Yeh

Ming-Chia Li

Liang-Hsiang Chen

Hsin-Chung Wu

Wen-Hsien Wang

Min-Tsung Kuan

En-Yu Pan

Chia-Hao Tsai

Chin-Lung Liao

The present disclosure provides a transparent elastic composite film, which includes a first film layer; a thermoplastic polyurethane layer; and a second film layer; wherein the first film layer and the second film layer have a crosslinked network structure; the first film layer includes acrylic resin and aliphatic polyisocyanate, wherein the acrylic resin includes hydroxyl-containing acrylic resin, and a weight ratio of the acrylic resin to the aliphatic polyisocyanate is 1/1 to 1/1.2, and a weight ratio of the hydroxyl-containing acrylic resin to the acrylic resin is 0.1/1 to 0.18/1.

Transparent elastic composite film and its encapsulation structure and method for forming the encapsulation structure

A wavelength-converting polymer, a method for fabricating the same and a wavelength-converting device employing the same are provided. The wavelength-converting polymer has a chemical structure represented by formula (I):  In formula (I), B and D are the same or different and independently include hydrogen, C1-8 alkyl group, C1-8 alkoxy group, aryloxy group, carboxyl group, &#x2014;COOK, &#x2014;COONa or &#x2014;NH, or B and D are connected to form a heteroaromatic ring, wherein Z is hydrogen, C1-8 alkyl group, cycloalkyl group or aryloxy group, X-Xare the same or different and independently include hydrogen, halogen, C1-8 alkyl group or C1-8 alkoxy group, R is C1-8 alkyl group with or without substitution, and n is an integer of 5 to 1,000.

Wavelength-converting polymers, method for fabricating the same, and wavelength-converting devices employing the same

A package structure of an electronic device includes a first substrate, a second substrate, an electronic device and a first barrier structure. The first substrate includes a first light-transmitting portion and a periphery portion. The second substrate includes a second light-transmitting portion and two covering portions located on two sides of the second light-transmitting portion. The first light-transmitting portion is disposed corresponding to the second light-transmitting portion, and a device disposition region exists therebetween. The covering portions cover the periphery portion of the first substrate and two opposite side surfaces of the first substrate. The electronic device is disposed on the first or second substrate, and is located in the device disposition region. The first barrier structure disposed on the first substrate or the second substrate is disposed corresponding to the periphery portion and disposed on at least one side of the device disposition region.

Package structure of electronic device

A composition for photosensitive dielectric material is provided. The composition includes 4 to 10 percent by weight of a polymer material, 1.5 to 10 percent by weight of a crosslinking agent, 0.32 to 2 percent by weight of a photoacid generator (PAG) and 78 to 94.18 percent by weight of solvent, based on a total weight of the composition.

Composition for photosensitive organic dielectric material and application thereof

Growing community of inventors

Changhua County, Taiwan

Mei-Ru Lin