Infineon Technologies Ag

Mei Qi Tay

Josef Hoeglauer

Angela Kessler

Kok Yau Chua

Michael Stadler

Paul Armand Asentista Calo

Fong Lim

Tien Heng Lem

Tek Keong Gan

Chiah Chin Lim

Ser Yee Keh

A package and method of manufacturing is disclosed. In one example, the package which comprises a carrier with at least one component mounted on the carrier. A clip is arranged above the carrier and having a through hole. At least part of at least one of the at least one component and/or at least part of an electrically conductive connection element electrically connecting the at least one component is at least partially positioned inside the through hole.

Package with clip having through hole accommodating component-related structure

An electrical interconnect structure includes a bond pad having a substantially planar bonding surface, and a solder enhancing structure that is disposed on the bonding surface and includes a plurality of raised spokes that are each elevated from the bonding surface. Each of the raised spokes has a lower wettability relative to a liquefied solder material than the bonding surface. Each of the raised spokes extend radially outward from a center of the solder enhancing structure.

Electrical interconnect structure with radial spokes for improved solder void control

Growing community of inventors

Melaka, Malaysia

Mei Qi Tay