Innolux Corporation

Mei-Hsiu Pan

Chung-Wen Yen

Mei-Chi Hsu

Tzu-Yi Liu

Hsi-Chia Wu

A connection structure is provided. The connection structure includes a first conductive pad, a first insulating layer, a second conductive pad, a second insulating layer, and a third conductive pad. The first insulating layer is disposed on the first conductive pad and includes a first through-hole. The second conductive pad is disposed on the first insulating layer and electrically connected to the first conductive pad through the first through-hole. The second insulating layer is disposed on the second conductive pad and includes a second through-hole and a first recessed portion. The first recessed portion overlaps the first through-hole. The third conductive pad is disposed on the second insulating layer and electrically connected to the second conductive pad through the second through-hole. The third conductive pad extends on a surface of the first recessed portion.

Connection structure and electronic device

An electronic device includes a substrate, a first bus line, a second bus line, a plurality of driving units, a first signal line and a second signal line. The first bus line is disposed on the substrate and outputs a first signal. The second bus line is disposed on the substrate and outputs a second signal. The driving units are disposed between the first bus line and the second bus line, and include a first driving unit and a second driving unit which are adjacent to each other. The first signal line is electrically connected to the first bus line and transmits the first signal to the first driving unit and the second driving unit. The second signal line is electrically connected to the second bus line and transmits the second signal to at least one of the first driving unit and the second driving unit.

Growing community of inventors

Miao-Li County, Taiwan

Mei-Hsiu Pan