Telefonaktiebolaget Lm Ericsson (publ)

Mehrdad Mir Shafiei

Robert Frank Brunner

Stephane Lessard

Julie Dufort

There is provided a reconfigurable optical modulator comprising a light source and a splitter operative to receive an input signal from the light source and to split the input signal into a plurality of split signals. The optical modulator comprises a plurality of optical amplifiers, each being operative to receive one of the plurality of split signals as an input and to act as a switch having a first state where the split signal is blocked and a second state where the split signal is amplified. The optical modulator comprises a plurality of modulators, each being operative to receive an amplified split signal from one of the plurality of optical amplifiers and to modulate the amplified split signal into a modulated signal. The optical modulator comprises an optical combiner operative to combine a plurality of modulated signals produced by the plurality of modulators to thereby produce a modulated output signal.

Reconfigurable optical modulator

The disclosure relates to a tunable microring resonator, comprising a primary waveguide having first and second ends, a plurality of secondary waveguides each having a different length and each having first and second ends and a Micro-Electro-Mechanical System (MEMS) adjustable to optically couple at least a first end of the primary waveguide with a first respective end of a selected secondary waveguide thereby allowing light to circulate within the tunable microring resonator.

Tunable microring resonator

The teachings herein disclose a laser assembly () that implements a 'composite cavity' formed in part in a III/V die (), in part in a silicon die (), and in part in a glass member () having a waveguide () coupling the cavity portion in the III/V die with the cavity portion in the silicon die. This arrangement capitalizes on the lasing efficiency of the III/V die, which is used as the gain medium while advantageously using the glass member to extend the lasing cavity into the silicon die. Laser-scribing the cavity waveguide in place after mounting the III/V die, the silicon die or dies, and the glass member, greatly relaxes the mounting alignment precision needed for the constituent parts of the overall assembly. Moreover, in one or more embodiments, glass member includes one or more laser-scribed waveguides operative as optical interconnects going between two or more silicon dies.

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Montreal, Canada

Mehrdad Mir Shafiei