The University of North Carolina at Charlotte

Mehrdad Biglarbegian

Babak Parkhideh

Neel Mayur Shah

Devices, systems, and methods of manufacture relating to PCB embedded inductors are described in the present disclosure. Namely, an example device includes a substrate having an upper surface and an opposing lower surface. The device also includes a plurality of upper conductors disposed along the upper surface and a plurality of lower conductors disposed along the lower surface. The upper conductors and the lower conductors are radially disposed about a central axis. Each of the upper conductors and the lower conductors includes a petal shape. A distance between adjacent upper conductors is less than a width of each upper conductor and a distance between adjacent lower conductors is less than a width of each lower conductor. The device also includes a plurality of through-substrate conductors connecting respective upper conductors to respective lower conductors so as to form a series electrical connection. The series electrical connection includes a toroid configuration.

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Charlotte, NC, United States of America

Mehrdad Biglarbegian