Infineon Technologies Ag

Mehran Pour Mousavi

Maciej Wojnowski

Gottfried Beer

Saverio Trotta

Walter Hartner

Klaus Pressel

Ernst Seler

Jagjit Singh Bal

Ottmar Geitner

According to an embodiment, a circuit board includes a signal line including at least portion of a first conductive layer that has a first portion extending over a cavity in the circuit board from a first side of the cavity. The circuit board also includes a first plurality of conductive vias surrounding the cavity and the first plurality of vias include at least one blind via disposed adjacent to the first side of the cavity.

Millimeter-wave system including a waveguide transition connected to a transmission line and surrounded by a plurality of vias

In one embodiment of the present invention, a semiconductor package includes a substrate having a first major surface and an opposite second major surface. A chip is disposed in the substrate. The chip includes a plurality of contact pads at the first major surface. A first antenna structure is disposed at the first major surface. A reflector is disposed at the second major surface.

Semiconductor packages with integrated antenna and method of forming thereof

In accordance with an embodiment of the present invention, a semiconductor package includes a substrate having a first major surface and an opposite second major surface. A first chip is disposed in the substrate. The first chip includes a plurality of contact pads at the first major surface. A via bar is disposed in the substrate. An antenna structure is disposed within the via bar.

Semiconductor packages with integrated antenna and methods of forming thereof

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Munich, Germany

Mehran Pour Mousavi