Skyworks Solutions, Inc.

Mehran Janani

Hong Shen

Peter J Zampardi

Hsiang-Chih Sun

Jens Albrecht Riege

David Steven Ripley

Philip John Lehtola

Hongxiao Shao

Matthew Ozalas

Tin Myint Ko

Weimin Sun

Anthony James Lobianco

Hoang Mong Nguyen

Howard E Chen

Dinhphuoc Vu Hoang

Guohao Zhang

Matthew Sean Read

Hardik Bhupendra Modi

Sandra Louise Petty-Weeks

Patrick Lawrence Welch

Yifan Guo

Matthew Thomas Ozalas

One aspect of this disclosure is a power amplifier module that includes a power amplifier, a semiconductor resistor, a tantalum nitride terminated through wafer via, and a conductive layer electrically connected to the power amplifier. The semiconductor resistor can include a resistive layer that includes a same material as a layer of a bipolar transistor of the power amplifier. A portion of the conductive layer can be in the tantalum nitride terminated through wafer via. The conductive layer and the power amplifier can be on opposing sides of a semiconductor substrate. Other embodiments of the module are provided along with related methods and components thereof.

Power amplifier modules including semiconductor resistor and tantalum nitride terminated through wafer via

One aspect of this disclosure is a power amplifier module that includes a power amplifier configured to amplify a radio frequency (RF) signal and tantalum nitride terminated through wafer via. The power amplifier includes a heterojunction bipolar transistor and a p-type field effect transistor, in which a semiconductor portion of the p-type field effect transistor corresponds to a channel includes the same type of semiconductor material as a collector layer of the heterojunction bipolar transistor. A metal layer in the tantalum nitride terminated through wafer via is included in an electrical connection between the power amplifier on a front side of a substrate and a conductive layer on a back side of the substrate. Other embodiments of the module are provided along with related methods and components thereof.

Power amplifier modules including tantalum nitride terminated through wafer via and related systems, devices, and methods

A power amplifier module includes a power amplifier including a GaAs bipolar transistor having a collector, a base abutting the collector, and an emitter, the collector having a doping concentration of at least about 3&#xd7;10cmat a junction with the base, the collector also having at least a first grading in which doping concentration increases away from the base; and an RF transmission line driven by the power amplifier, the RF transmission line including a conductive layer and finish plating on the conductive layer, the finish plating including a gold layer, a palladium layer proximate the gold layer, and a diffusion barrier layer proximate the palladium layer, the diffusion barrier layer including nickel and having a thickness that is less than about the skin depth of nickel at 0.9 GHz. Other embodiments of the module are provided along with related methods and components thereof.

Power amplifier modules including related systems, devices, and methods

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Oak Park, CA, United States of America

Mehran Janani