Growing community of inventors

Cartersville, GA, United States of America

Mehran Jafari

Average Co-Inventor Count = 6.52

ph-index = 2

The patent ph-index is calculated by counting the number of publications for which an author has been cited by other authors at least that same number of times.

Forward Citations = 12

Mehran JafariAndrea Piana (8 patents)Mehran JafariAndy Hollis (8 patents)Mehran JafariEric McCann (7 patents)Mehran JafariHelias Andriessen (7 patents)Mehran JafariSang-hoon Lim (6 patents)Mehran JafariMichael Stephen DeFranks (2 patents)Mehran JafariJorge C Fialho (1 patent)Mehran JafariForrest Wen Liau (1 patent)Mehran JafariStefan Kuzmanovski (1 patent)Mehran JafariSam Lim (1 patent)Mehran JafariAlfio Borgatti (1 patent)Mehran JafariEric Mccann (1 patent)Mehran JafariMichael Stephen Defranks (1 patent)Mehran JafariAndreas Piana (0 patent)Mehran JafariMehran Jafari (8 patents)Andrea PianaAndrea Piana (25 patents)Andy HollisAndy Hollis (13 patents)Eric McCannEric McCann (9 patents)Helias AndriessenHelias Andriessen (7 patents)Sang-hoon LimSang-hoon Lim (18 patents)Michael Stephen DeFranksMichael Stephen DeFranks (5 patents)Jorge C FialhoJorge C Fialho (8 patents)Forrest Wen LiauForrest Wen Liau (6 patents)Stefan KuzmanovskiStefan Kuzmanovski (2 patents)Sam LimSam Lim (1 patent)Alfio BorgattiAlfio Borgatti (1 patent)Eric MccannEric Mccann (1 patent)Michael Stephen DefranksMichael Stephen Defranks (1 patent)Andreas PianaAndreas Piana (0 patent)
..
Inventor’s number of patents
..
Strength of working relationships

Company Filing History:

1. Piana Nonwovens, LLC. (8 from 11 patents)

2. Tesla, Inc. (1 from 536 patents)


8 patents:

1. 12465831 - Systems and methods for mobile molding and bonding

2. 12246483 - Self-rising board molding

3. 11993027 - Self-rising board molding

4. 11780177 - Self rising board molding

5. 11771971 - Systems and methods for mobile molding and bonding

6. 11554699 - Fibrous foam architecture

7. 11472132 - Self-rising board molding

8. 11186063 - Lapped nonwoven with attachable backing and applications thereof

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as of
1/11/2026
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