Cisco Technology, Inc.

Mehmet Onder Cap

Joel Richard Goergen

D Brice Achkir

Damaruganath Pinjala

Rohit Dev Gupta

Alpesh Umakant Bhobe

M Baris Dogruoz

Amendra Koul

David Nozadze

Jessica Kiefer

Scott Hinaga

Madeline Marie Roemer

Manigandan Boopalan

Shailesh R Nayak

Manjunatha Reddy Shivashankara

Marc Henry Mantelli

Mohammed Ghouse

Sandeep Mehdiratta

Robert Gregory Twiss

Arjun Guzar Jayaprakash

Jatin Kohli

Giridharan Rajagopalan

Umeshbabu Nandanan

In one embodiment, a thermal management device includes a heat sink base and heat sink fins comprising a single element formed from a plurality of graphene layers with carbon nanotubes interposed between the graphene layers. A method is also disclosed herein.

Graphene and carbon nanotube based thermal management device

A conductive signal transmission structure for a printed circuit includes a copper material and a graphene layer disposed within the copper material at a depth below a surface of the structure. The depth of the graphene layer is further within a skin depth region of the structure when a transmission signal applied to the conductive signal transmission structure has a signal speed of at least 112 Gbps and/or a Nyquist frequency that is at least about 14 gigahertz (GHz).

Integrating graphene into the skin depth region of high speed communications signals for a printed circuit board

In one embodiment, an apparatus includes a chassis base, a printed circuit board mounted on the chassis base, a heatsink positioned over the printed circuit board to prevent corrosion of components on the printed circuit board, wherein the heatsink comprises a plurality of upward extending fins and a plurality of downward extending walls, a seal interposed between an edge of the downward extending walls and the chassis base, and a cover extending over the heatsink.

Corrosion preventive heatsink for network device

A conductive signal transmission structure for an electronic device (e.g., a printed circuit board of an electronic device) includes a copper material and a graphene layer disposed within the copper material at a depth below a surface of the structure. The depth of the graphene layer is further within a skin depth region of the structure when a transmission signal applied to the conductive signal transmission structure has a signal speed of at least 112 Gbps.

In one example, a first tubular member has a first diameter and is configured to attach to a printed circuit board. A second tubular member has a second diameter different from the first diameter and is configured to hold an environmental sensor for collecting data relating to an environment of the printed circuit board. The second tubular member is vertically adjustable relative to the first tubular member.

Adjustable anchor for printed circuit board environmental sensor

A conductive signal transmission structure for an electronic device (e.g., a printed circuit board of an electronic device) includes a copper material and a graphene layer disposed within the copper material at a depth below a surface of the structure. The depth of the graphene layer is further within a skin depth region of the structure when a transmission signal is applied to the structure that is in the GHz frequency range.

In one embodiment, an apparatus includes a cover configured for installation over a connector mounted on a printed circuit board and operable to couple a module to the printed circuit board, the cover comprises a lower surface for contact with the printed circuit board and a slot for receiving the module for attachment of the module to the connector. The cover encloses contacts at the connector for mating with the module and the printed circuit board to prevent corrosion of the contacts.

Corrosion prevention cover for module connector in a network device

In one embodiment, an apparatus includes an optical module comprising a first end for insertion into a network device and a second end extending from the network device when the optical module is inserted into the network device, and a thermal protective layer extending over a portion of the second end of the optical module, the thermal protective layer preventing direct contact with an external surface of the optical module during removal of the optical module from the network device. The thermal protective layer exposes a portion of the external surface of the second end of the optical module to allow heat to be released from the external surface of the optical module.

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Sunnyvale, CA, United States of America

Mehmet Onder Cap