Electro Scientific Industries, Inc.

Mehmet Emin Alpay

Brian C Johansen

Jeffrey Howerton

David Childers

Jan Kleinert

Mark Alan Unrath

Ho Wai Lo

Robert B Reichenbach

Kurt M Eaton

James Brookhyser

Qian Xu

Zhibin Lin

Jeff Howerton

Guang Lu

Mike Tyler

Ling Wen

Michael S Nashner

Hisashi Matsumoto

Mark Kosmowski

Guangyu Li

David A Watt

John T Wen

Patrick Leonard

Michael John Darwin

David James McKeever

Jefferey Howerton

Andy Moore

Jim Brookhyser

Yanfei Jiang

Heny Sadikin

Ben Potsaid

One embodiment of the present invention can be characterized as a method for controlling a multi-axis machine tool that includes obtaining a preliminary rotary actuator command (wherein the rotary actuator command has frequency content exceeding a bandwidth of a rotary actuator), generating a processed rotary actuator command based, at least in part, on the preliminary rotary actuator command, the processed rotary actuator command having frequency content within a bandwidth of the rotary actuator and generating a first linear actuator command and a second linear actuator command based, at least in part, on the processed rotary actuator command. The processed rotary actuator command can be output to the rotary actuator, the first linear actuator command can be output to a first linear actuator and the second linear actuator command can be output to a second linear actuator.

Multi-axis machine tool and methods of controlling the same

The invention is a method and an apparatus for marking an article and the article thus marked. It includes providing the article. Generating a plurality of groups of laser pulses. At least one of the plurality of groups is generated by modulating a beam of laser pulses to form a plurality of beamlets. Each, of the plurality of beamlets, include at least one laser pulse. It also includes directing the plurality of groups of laser pulses onto the article such that laser pulses within the at least one of the plurality of groups impinge upon the article at spot areas that do not overlap one another, wherein laser pulses within the plurality of groups are configured to produce a visible mark on the article.

Method and apparatus for marking an article

Systems and methods for enabling automated motion control of a tool in a multi-axis machine tool

Numerous embodiments of interactive control systems, methods of making the same, and devices incorporating the same are disclosed. In one embodiment, a system includes a light-resistant material; light-transmissive holes penetrating in a light-transmissive pattern through the light resistant material; and a lens disposed adjacent to the light-transmissive pattern.

Interactive control system, methods of making the same, and devices incorporating the same

Systems and methods reduce or prevent back-reflections in a laser processing system. A system includes a laser source to generate an incident laser beam, a laser beam output to direct the incident laser beam toward a work surface along a beam path, and a spatial filter. The system further includes a beam expander to expand a diameter of the incident laser beam received through the spatial filter, and a scan lens to focus the expanded incident laser beam at a target location on a work surface. A reflected laser beam from the work surface returns through the scan lens to the beam expander, which reduces a diameter of the reflected beam and increases a divergence angle of the reflected laser beam. The spatial filter blocks a portion of the diverging reflected laser beam from passing through the aperture and returning to the laser beam output.

Reducing back-reflection in laser micromachining systems

An improved method and apparatus for drilling tapered holes in workpieces with laser pulses is presented which uses defocused laser pulses to machine the holes with specified taper and surface finish while maintaining specified exit diameters and improved system throughput. A system is described which can also drill holes with the desired taper and surface finish without requiring defocused laser pulses.

Method and apparatus for laser drilling holes with Gaussian pulses

Systems and methods cut trenches of multiple widths in a material using a single pass of a laser beam. A first series of laser pulses cut a work surface of the material at a first cutting speed using a first spot size. In a transition region from a first trench width to a second trench width, a second series of laser pulses sequentially change spot sizes while gradually changing from the first cutting speed to a second cutting speed. Then, a third series of laser pulses continue to cut the work surface at the second cutting speed using a second spot size. The method provides for increased depth control in the transition region. A system uses a selectively adjustable optical component in the laser beam path to rapidly change spot size by adjusting a position of a focal plane with respect to the work surface.

On-the-fly manipulation of spot size and cutting speed for real-time control of trench depth and width in laser operations

A laser-based displacement detector is used to detect cosmetic coatings applied to one surface of the transparent article and thereby determine which side is uppermost when loaded into the laser processing system. In particular, articles that are transparent to visible light and are particularly difficult to orient properly in laser processing systems are oriented using a laser-based displacement detector in conjunction with a partial coating on the article.

Apparatus and method for non-contact sensing of transparent articles

Laser direct ablation (LDA) produces patterns cut into a dielectric layer for the formation of electrically conductive traces with controlled signal propagation characteristics. LDA processing includes selecting a dose fluence for removing a desired depth of material along a scribe line on a surface of a workpiece, selecting a temporal pulsewidth for each laser pulse in a series of laser pulses, and selecting a pulse repetition frequency for the series of laser pulse. The pulse repetition frequency is based at least in part on the selected temporal pulsewidth to maintain the selected dose fluence along the scribe line. The selected pulse repetition frequency provides a predetermined minimum overlap of laser spots along the scribe line. The LDA process further includes generating a laser beam including the series of laser pulses according to the selected dose fluence, temporal pulsewidth, and pulse repetition frequency.

Laser direct ablation with picosecond laser pulses at high pulse repetition frequencies

The invention is a method and apparatus for laser marking a stainless steel specimen with commercially desirable marks. The method includes providing a laser processing system having a laser, laser optics and a controller with pre-determined laser pulse parameters, selecting the pre-determined laser pulse parameters associated with the desired mark, and directing the laser marking system to produce laser pulses having laser pulse parameters associated with the desired marks including temporal pulse widths greater than about 1 and less than about 1000 picoseconds.

Method and apparatus for optimally laser marking articles

A method for laser machining through micro-holes having desired geometric cross-section requirements in a thin, substantially homogenous material.

Method for machining tapered micro holes

An orthogonal integrated cleaving apparatus and methods of controlling such an apparatus are taught. The cleaving apparatus includes two cleaving devices mounted at right angles with respect to a mount facing a substrate to be processed. The non-metallic and/or brittle substrate is separated along two orthogonal axes without rotating or moving the substrate to a second machine by moving the mount or the substrate along the axes. Each cleaving device laser sequentially heats a surface of the substrate along a respective cutting axis, cools the cut area and then laser re-heats the cut area to form a clean break.

Orthogonal integrated cleaving device

A process and apparatus neutralizes a warp effect resulting from a build up of micro strains caused by machining a part with a long wavelength laser. The part to be machined is pre-stressed in an opposite direction of a warp stress due to machining using a fixture for holding the part without yielding any other features in the part. The part is machined while held in the pre-stressed position in the fixture.

Pre-process stress loading components for post-process warp control

The embodiments disclosed herein provide systems and methods for correcting a head-to-head offset in a laser machining system with two or more processing heads. A focusing lens is associated with each processing head, and is configured to receive an incident laser beam along an incident beam axis of propagation. The incident beam axis of propagation is offset from the primary axis of the focusing lens. The focusing lens is further configured to rotate about the incident beam axis of propagation in order to steer the incident laser beam's path with respect to a workpiece.

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Portland, OR, United States of America

Mehmet Emin Alpay