Gradient Design Automation Inc.

Carnegie Mellon University

Mehdi Asheghi

Rajit Chandra

Peng Li

Larry Pileggi

Yang Xu

Lawrence Thomas Pileggi

A method and apparatus for modeling and thermal analysis of semiconductor chip designs is provided. One embodiment of a novel method for performing thermal testing of a semiconductor chip design includes calculating full-chip temperatures over the semiconductor chip design (e.g., to identify steep thermal gradients) and modeling the full-chip temperatures in accordance with a geometric multi-grid technique. The geometric multi-grid technique is tailored to determine temperatures within the semiconductor chip design based at least in part on the physical attributes or geometry of the design.

Method and apparatus for thermal modeling and analysis of semiconductor chip designs

Configurable circuits using phase change switches are described. The switches use phase change or phase transition material to create configurable connections between devices and/or interconnecting layers of an integrated circuit in order to change the behavior of the circuit after manufacturing. In at least some embodiments, the phase of the material can be a crystalline phase or an amorphous phase. A phase change can be caused by heating the material, such as with an ohmic heater fabricated on the IC. As one example, germanium-antimony-tellurium (GeSbTe) can be used for the phase change material. The switches can be used to create configurable circuits such as low noise amplifiers and mixers, which can in turn be used to create configurable receivers or other analog circuits.

Configurable circuits using phase change switches

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Pittsburgh, PA, United States of America

Mehdi Asheghi