Mitsubishi Gas Chemical Company, Inc.

Subaru Corporation

Meguru Ito

Eisuke Shiga

Katsuya Tomizawa

Yoichi Takano

Tomoki Hamajima

Tomo Chiba

Yoshihiro Kato

Kentaro Takano

Shohei Yamaguchi

Seisuke Kasaoki

Takeshi Nobukuni

Nobuyoshi Ohnishi

Shota Koga

Naoki Kashima

Tomoe Morishita

Takashi Kubo

A resin composition comprising a maleimide compound, a cyanate ester compound, a silane compound having a styrene skeleton and a hydrolyzable group or a hydroxy group, and an inorganic filler.

Resin composition, prepreg, resin sheet, metal foil-clad laminate, and printed circuit board

A resin composition that includes a maleimide compound, an alkenyl-substituted nadimide, a silane compound having a styrene skeleton and a hydrolyzable group or a hydroxy group, and an inorganic filler.

A resin composition comprising a thermosetting resin, a functional group-modified copolymer, and an inorganic filler, wherein the functional group-modified copolymer has two or more alkyl (meth)acrylate units, or one or two or more alkyl (meth)acrylate units and an acrylonitrile unit, and at least a part of alkyl ester groups of the alkyl (meth)acrylate units and/or a cyano group of the acrylonitrile unit are/is modified with at least one selected from the group consisting of an epoxy group, a carboxyl group, and an amide group.

Resin composition, prepreg, metal foil-clad laminate, and printed circuit board

It is intended to provide a resin composition that suppresses the thermal expansion of a printed circuit board more than ever and also prevents the bleedout of substances from the printed circuit board, while maintaining a high glass transition temperature. The resin composition of the present invention contains an alkenyl-substituted nadimide, a maleimide compound, and an epoxy-modified cyclic silicone compound.

A prepreg including: a thermosetting resin composition (C) containing a thermosetting resin (A) and an inorganic filler (B); and a glass cloth (D) impregnated or coated with the thermosetting resin composition (C);

Prepreg, metal foil-clad laminate, and printed wiring board

The present invention provides a resin composition containing an alkenyl-substituted nadimide and a perinone-based colorant, wherein the content of the perinone-based colorant is 0.8 parts by mass or less based on 100 parts by mass in total of resin-constituting components in the resin composition.

Resin composition and prepreg, resin sheet, laminate, and printed circuit board comprising same

It is intended to provide a resin composition that serves as a raw material for a printed circuit board excellent in heat resistance after moisture absorption and is excellent in moldability. The resin composition of the present invention contains a maleimide compound, a silane compound having a carbon-carbon unsaturated bond and a hydrolyzable group or a hydroxy group, a silane compound having an epoxy skeleton and a hydrolyzable group or a hydroxy group, and an inorganic filler.

The present invention provides a resin composition containing an allyl group-containing compound (A) and a maleimide compound (B), in which the allyl group-containing compound (A) has a reactive functional group other than an allyl group.

The present invention provides an insulating layer for printed circuit boards having a difference of within 20% between the flexural modulus at 25&#xb0; C. and the flexural modulus under heat at 250&#xb0; C.

Insulating layer for printed circuit board and printed circuit board

A vehicle exterior environment recognition apparatus includes a computer configured to serve as a vehicle identifier, a candidate identifier, an overexposure identifier, a movement amount deriving unit, a moving overexposure identifier, an overexposure range setting unit, and a lamp determiner. The candidate identifier identifies a light-emission source candidate. The overexposure identifier identifies an overexposed light-emission source candidate. The movement amount deriving unit derives an amount of movement of the overexposed light-emission source candidate. The moving overexposure identifier identifies a moving overexposed light-emission source, when the amount of movement is equal to or greater than a threshold. The overexposure range setting unit sets an overexposure range with respect to the moving overexposed light-emission source. The lamp determiner determines whether the identified light-emission source candidate is a lighted lamp, based on different conditions between the light-emission source candidate in the overexposure range and that in a range other than the overexposure range.

Vehicle exterior environment recognition apparatus

A resin composition contains a cyanate ester compound, a maleimide compound, an epoxy resin, a silicone rubber powder, and an inorganic filler. The cyanate ester compound contains a compound represented by the following formula. The silicone rubber powder is contained in an amount of 40 to 150 parts by mass based on 100 parts by mass in total of the cyanate ester compound, the maleimide compound, and the epoxy resin. The inorganic filler is contained in an amount of 100 to 340 parts by mass based on 100 parts by mass in total of the cyanate ester compound, the maleimide compound, and the epoxy resin. A total content of the silicone rubber powder and the inorganic filler is 140 to 380 parts by mass based on 100 parts by mass in total of the cyanate ester compound, the maleimide compound, and the epoxy resin. 

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Tokyo, Japan

Meguru Ito