Versiv Composites Limited

Saint-gobain Performance Plastics Corporation

Nanocomp Technologies, Inc.

Meghann White

Sethumadhavan Ravichandran

Gerard T Buss

Jennifer Adamchuk

Dale Thomas

David W Gailus

Mark Wallace Schauer

Peter Antoinette

Brian White

Michael A Adamko

Mark A Banash

Vincent Prud'homme

Gowri Dorairaju

Rachel Morrison

Mark Schauer

The present disclosure relates to a dielectric substrate that may include a first fluoropolymer based adhesive layer, a polyimide layer overlying the fluoropolymer based adhesive layer, and a first filled polymer layer overlying the polyimide layer. The first filled polymer layer may include a resin matrix component, and a first ceramic filler component. The first ceramic filler component may include a first filler material. The first filler material may further have a mean particle size of at not greater than about 10 microns.

Dielectric substrate and method of forming the same

The present disclosure relates to a copper-clad laminate that may include a copper foil layer, a fluoropolymer based adhesive layer overlying the copper foil layer, and a dielectric coating overlying the fluoropolymer based adhesive layer. The dielectric coating may include a resin matrix component, and a ceramic filler component. The ceramic filler component may include a first filler material. The dielectric coating may have an average thickness of not greater than about 20 microns.

Copper-clad laminate and method of forming the same

The present disclosure relates to a dielectric substrate that may include a polymer based core film, and a fluoropolymer based adhesive layer. The polymer based core film may include a resin matrix component, and a ceramic filler component. The ceramic filler component may include a first filler material. The particle size distribution of the first filler material may have a Dof at least about 1.0 microns and not greater than about 1.7, a Dof at least about 1.0 microns and not greater than about 3.5 microns, and a Dof at least about 2.7 microns and not greater than about 6 microns.

The present disclosure relates to a multilayer film may include a fluoropolymer based layer that may include a fluoropolymer based material, and an adhesive layer in contact with the fluoropolymer based layer. The adhesive layer may include a first ultra-violet (UV) absorber component. The multilayer film may have a lower ultra-violet light transmission (L-UVLT) of not greater than 1.0%, where the L-UVLT of the multilayer film is defined as the percent transmission between 200 nm and 360 nm. The multilayer film may further have a high ultra-violet light transmission (H-UVLT) of not greater than 5.0%, where the H-UVLT of the multilayer film is defined as the percent transmission between 360 nm and 380 nm. The multilayer film may include a visual light transmission (VLT) of at least about 50.0%, where the VLT of the multilayer film is defined as the percent transmission between 400 nm and 1100 nm.

Multilayer film and method of forming the same

An intumescent nanostructured material for thermal protection comprising a member including a plurality of nanostructured materials, and an intumescent material associated with the member and configured to react in the presence of a heat source to form a foam for thermally insulating the member from the heat source. The member may be a non-woven sheet, a woven sheet, a yarn, or a network, and may be configured to conduct thermal energy away from a heat source. A solution comprising a plurality of nanostructured materials, an intumescent material, and a solvent, wherein the solution has a viscosity suitable for coating or spraying onto a surface of a substrate. The solution may have a viscosity of about 3000 centipoise to about 6000 centipoise, and possibly less than about 1000 centipoise. The solution, when dried on the substrate, may form a thermally-protective coating on the substrate.

Intumescent nanostructured materials and methods of manufacturing same

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Bedford, NH, United States of America

Meghann White