International Business Machines Corporation

Megan J Shannon

Michael A Gaynes

Krishna Gandhi Sachdev

Jeffrey Allen Zitz

Charles Hampton Perry

Mario John Interrante

David James Alcoe

Raymond A Jackson

Randall Joseph Stutzman

William Edward Sablinski

Harvey Charles Hamel

Brenda Lee Peterson

Renee L Weisman

Jeffrey Thomas Coffin

Amy B Ostrander

Christopher Todd Spring

Electronic packages incorporating EMI shielding, and particularly semiconductor devices which incorporate semiconductor chip-carrier structures having grounded bands embedded therein which are adapted to reduce outgoing and incident EMI emissions for high-speed switching electronic packages.

EMI shielding for semiconductor chip carriers

The invention is directed to improved conductive adhesives for solder-free interconnections in microelectronic assembly processes such as for chip carrier-to-substrate attachment. These adhesives are characterized by low tensile modulus, low resistivity, high adhesion strength, and durability of these properties during reliability stress conditions of thermal shock, thermal aging, and temperature/humidity (85&deg; C./85%) exposure of the assembled devices. The adhesives contain a homogeneous solution of a siloxane containing epoxide, a curing agent, a curing catalyst and an organic polymeric or oligomeric additive. A conductive filler is added to the solution forming the filler. Preferred fillers are Ag coated with Pd and Ag coated with Au.

Epoxy-siloxanes based electrically conductive adhesives for semiconductor assembly and process for use thereof

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Wappingers Falls, NY, United States of America

Megan J Shannon