Samsung Electronics Co., Ltd.

Meehyun Lim

Sungyeol Kim

Jinyeong Yun

Hyungjung Yong

Sungjin Kim

Sunghyup Kim

Sungyong Lim

Sung-Yeol Kim

Daesung Jung

Myeongock Ko

Sunghwi Cho

Masahiko Yamabe

Hyung-jung Yong

Hosun Yoo

A test method for a semiconductor device includes determining a contact failure between a first semiconductor chip and a second semiconductor chip during assembly of a semiconductor package including the first semiconductor chip and the second semiconductor chip, using a test circuit embedded in the first semiconductor chip, and after the assembly of the semiconductor package, determining whether the semiconductor package is defective by using the test circuit.

Semiconductor test device and system and test method using the same

A substrate processing apparatus includes: a chamber configured to perform a wet process and having an internal space, a chuck in the internal spaced and being configured for loading a semiconductor substrate thereon, a probe having an end above the chuck and including an electro-optical crystal and a reflective mirror on one surface of the electro-optical crystal, a measuring unit connected to the probe and configured to provide reference light to the probe, and to detect a polarization component of reflected light reflected from the one end of the probe by the reference light, and a controller configured to calculate an amount of electrostatic charge on a surface of the semiconductor substrate from the polarization component.

Substrate processing apparatus

A plasma treatment apparatus includes a light generator that generates light, a chamber that receives the light generated from the light generator, an optical element provided between the light generator and the chamber, a light detector that detects the light reflected in the chamber, and a controller connected to the light generator and the light detector. The chamber includes an electrostatic chuck provided in a lower portion of the chamber, an edge ring provided around the electrostatic chuck, an outer wall for sealing an inner space of the chamber, and a gas supply that injects a process gas into the chamber. The optical element branches the generated light to irradiate branched light to different regions of the chamber.

Plasma treatment apparatus, a method of monitoring a process of manufacturing a semiconductor device by using the same, and a method of manufacturing a semiconductor device including the monitoring method

An electric field measuring apparatus includes an electrostatic chuck with a through hole and holding a wafer, a lift pin picking up the wafer, a driver vertically moving the lift pin along the through hole, a probe in the lift pin and having a refractive index changed by an electric field of the wafer, the probe including an electro-optical crystal, an optical waveguide forming at least one internal path of light having a polarization characteristic changed by the changed refractive index between the probe and the wafer, and a control module controlling the lift pin and the driver. The lift pin moves to first and second positions. The control module calculates a strength of the electric field of the wafer, using electric field data measured using the probe at each of the first and second positions.

Electric field measuring apparatus and method of measuring electric field using the same

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Seoul, South Korea

Meehyun Lim