Ocg Microelectronic Materials, Inc.

Olin Hunt Specialty Products Inc.

Philip A. Hunt Chemical Corporation

Olin Microelectronic Chemicals, Inc.

Arch Specialty Chemicals, Inc.

Medhat A Toukhy

Alfred T Jeffries, Iii

Andrew J Blakeney

Lawrence Ferreira

Arturo N Medina

Joseph J Sizensky

Thomas R Sarubbi

Sobhy Tadros

Ahmad A Naiini

Sanjay Malik

David J Brzozowy

Robert F Rogler

Leo Klawansky

A photosensitive compound comprising at least one o-quinonediazide sulfonic acid ester of a phenolic compound, said esters selected from the group consisting of formula (II): ##STR1## wherein the photosensitive compound is used in a radiation sensitive composition and a process for forming a positive patterned image.

Photosensitive diazonaphthoquinone esters based on selected cyclic alkyl

A high thermal alkali-soluble novolak binder resin, comprising the addition-condensation reaction product of a phenolic mixture with at least one aldehyde source, the feedstock of the phenolic mixture for the reaction comprising:

Selected high thermal novolaks and positive-working radiation-sensitive

A photosensitive compound comprising at least one o-quinonediazide sulfonic acid ester of a phenolic compound, said esters selected from the group consisting of formulae (IB) and (IIB): ##STR1## wherein the variables are as defined in the description.

Selected O-quinonediazide sulfonic acid esters of phenolic compounds and

A photosensitive compound comprising at least one o-quinonediazide sulfonic acid ester of a phenolic compound, said esters selected from the group consisting of formulae (IB) and (IIB): ##STR1## wherein the photosensitive compound is used in a radiation sensitive composition and a process for forming a positive patterned image.

O-quinonediazide sulfonic acid esters of phenolic compounds and their

A photosensitive compound comprising at least one o-quinonediazide sulfonic acid ester of a phenolic compound, said esters selected from the group consisting of formulae (IB) and (IIB): ##STR1## wherein the photosensitive compound is used in a positive photoresist composition and process for forming patterned image. Further the invention is drawn to a positive photoresist composition comprising an alkali-soluble resin and quinone diazide sulfonic acid triesters and diesters characterized by their HPLC peak areas.

Selected o-quinonediazide sulfonic acid esters of phenolic compounds and

A phenolic novolak composition prepared by a process comprising the steps of:

High ortho-ortho bonded novolak binder resins and their use in a process

A phenolic novolak composition prepared by a process comprising the steps of: (1) reacting a first phenolic monomer comprising a major portion of at least one trifunctional phenolic monomer with a first aldehyde source in the absence of a catalyst at a reaction temperature from about 100.degree. C. to about 200.degree. C. and at a reaction pressure of about 2 to about 15 atmospheres to form a phenolic oligomer having a weight average molecular weight from about 500 to about 2,000, having ortho--ortho bonding of about 55% to about 75% of the methylene bonds between the phenolic moieties; and having a time to clear of less than 125 seconds per micron; wherein the mole ratio of said first aldehyde source to said first phenolic monomer is from about 0.3:1.0 to about 0.55:1.0; and (2) then reacting said oligomer with an optional second phenolic source and a second aldehyde source at a temperature from about 80.degree. C. to about 150.degree. C. to form a phenolic novolak having a weight average molecular weight of 3,000 to 40,000, having ortho--ortho bonding of between 50% and 70% of the methylene bonds between the phenolic moieties, and having a time to clear of at least 20 seconds per micron; wherein the mole ratio of said second aldehyde source to said total phenolic moieties is less than about 0.8:1.0.

High ortho-ortho bonded novolak binder resins and their use in

A phenolic novolak resin composition comprising a condensation product of at least one aldehyde source with a phenolic source comprising 5-indanol. Said phenolic novolak resins are used in radiation-sensitive compositions, especially those useful as positive-working photoresists.

Phenolic novolak resin compositions containing 5-indanol and their use a

A radiation-sensitive composition comprising an admixture in a solvent of: at least one alkali-soluble binder resin, at least one photoactive compound and an effective sensitivity enhancing amount of at least one dimeric or trimeric unit formed by the condensation reaction of an aldehyde with sesamol; the amount of said binder resin being about 60 to 95% by weight, the amount 40% of said photoactive component being about 5% to about by weight, based on the total solids content of said radiation-sensitive composition.

Positive image formation utilizing radiation sensitive mixture

Radiation-sensitive compositions containing 5-indanol in the binder

A radiation sensitive mixture comprising an alkali-soluble binder resin and at least one photoactive compound comprising a compound of formula (I): ##STR1## wherein each R is individually selected from hydrogen and a lower alkyl group having 1 to 4 carbon atoms; n is either 0, 1, or 2; and D is selected from the group consisting of hydrogen or o-naphthoquinone diazide sulfonyl group; with the proviso that at least two D's are o-naphthoquinone diazide sulfonyl groups, and wherein the amount of said binder resin is about 70 to 95% by weight and the amount of photoactive compound being from about 5 to about 30% be weight, based on the total solids content of said content of said raditional-sensitive mixture.

Process of developing a positive image utilizing o-naphthoquinone

O-naphthoquinone diazide sulfonyl esters of

A radiation-sensitive composition comprising an admixture in a solvent of: at least one alkali-soluble binder resin, at least one photoactive compound and an effective sensitivity enhancing amount of at least one dimeric or trimeric unit formed by the condensation reaction of an aldehyde with sesamol; the amount of said binder resin being about 60 to 95% by weight, the amount of said photoactive component being about 5% to about 40% by weight, based on the total solids content of said radiation-sensitive composition.

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Barrington, RI, United States of America

Medhat A Toukhy