Micron Technology Incorporated

Md Zahid Hossain

Yongjun Jeff Hu

David A Kewley

Robert J Hanson

Daniel Billingsley

Suresh Ramarajan

Xiaosong Zhang

Keen Wah Chow

Biow Hiem Ong

Michael J Irwin

An apparatus comprises a structure including an upper insulating material overlying a lower insulating material, a conductive element underlying the lower insulating material, and a conductive material comprising a metal line and a contact. The conductive material extends from an upper surface of the upper insulating material to an upper surface of the conductive element. The structure also comprises a liner material adjacent the metal line. A width of an uppermost surface of the conductive material of the metal line external to the contact is relatively less than a width of an uppermost surface of the conductive material of the contact. Related methods, memory devices, and electronic systems are disclosed.

Apparatus and memory device including conductive lines and contacts, and methods of forming an apparatus including conductive lines and contacts

Apparatus comprising structures including contact vias and conductive lines, related methods, and memory devices

Growing community of inventors

Boise, ID, United States of America

Md Zahid Hossain