Qorvo Us, Inc.

Md Hasnine

Jeffrey Miller

Neftali Salazar

Yu Gary Gu

A system in package (SiP) with an air cavity is disclosed. In one aspect, a technique to bond a lid over the air cavity that reduces the risk of cavity integrity failure is provided. More specifically, a metal ring is provided that conforms to or is congruent to a shape of a lower lip of the lid. A dielectric material covers the metal ring, and a low modulus epoxy is used to bind the lower lip of the lid to the dielectric material. The lid and metal ring may have comparable thermal coefficients, which, when coupled with the low modulus epoxy, reduces chance of gross failure of the cavity.

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Richardson, TX, United States of America

Md Hasnine