Sanyo Electric Co., Ltd.

Semiconductor Technology Academic Research Center

Panasonic Intellectual Property Management Co., Ltd.

Mayumi Nakasato

Ryosuke Usui

Hideki Mizuhara

Masaki Yoshimaru

Sumio Hosaka

Hayato Sone

Takashi Ono

Masayuki Nagamatsu

Kouichi Saitou

Yasunori Inoue

Yoshio Okayama

Tetsuji Omura

Sadamichi Takakusaki

Yasuyuki Yanase

Yasuhiro Kohara

Kazuhiro Sasada

Masahiro Oda

Takaya Kusabe

Katsumi Ito

Fusanori Watanabe

Yusuke Igarashi

Koichi Saito

Yoh Takano

Makoto Izumi

Hajime Kobayashi

Kiyoshi Shibata

Toru Dan

Masurao Yoshii

Kotaro Deguchi

A cell module comprises: a cell stack comprising multiple cells which are electrically connected to each other; a plate-shaped heat dissipating member arranged such that it extends along a direction in which the multiple cells are arranged, and such that it is thermally connected to the multiple cells; and an intervening layer arranged between the cell stack and the heat dissipating member, and configured to allow heat to propagate from the cell stack to the heat dissipating member, and to suppress a relative displacement between the cell stack and the heat dissipating member.

Cell module and manufacturing method for cell module

A cell module comprises: a cell stack comprising multiple cells which are electrically connected to each other; a plate-shaped heat dissipating member arranged such that it extends along a direction in which the multiple cells are arranged, and such that it is thermally connected to the multiple cells ; and an intervening layer arranged between the cell stack and the heat dissipating member, and configured to allow heat to propagate from the cell stack to the heat dissipating member, and to suppress a relative displacement between the cell stack and the heat dissipating member.

A device mounting board comprises: a heat dissipating substrate formed of a material containing at least one metal material selected from a group including Al, Mg, and Ti; an insulting resin layer laminated on the heat dissipating substrate; and a wiring layer laminated on the insulating resin layer, and on which a power module is to be mounted. The heat dissipating substrate comprises a random porous layer arranged such that it faces the insulating resin layer, and having cavities elongated in respective random directions.

Device mounting board, cell, and battery module

Prepared in advance is a substrate formed of metallic material where slits are formed between mounting regions. Oxide films are generated all over the substrate including end faces of the substrate. Exposed are only lateral faces corresponding to the cross sections cut when tie bars are cut. This structure and the fabrication method minimize the area of cutting faces in the metallic material.

Element mounting board and semiconductor module

Conventional printed circuit boards had a problem of being inferior in heat-radiation characteristic, and metal-core printed circuit boards adopted to improve the heat-radiation characteristic had problems in having low rigidity and a tendency to bend. The ductility of the metal can be obstructed, and the metal protected; by covering substantially the whole area of the front and back sides of the metal core, consisting of metal as the main material, with a first ceramic film and a second ceramic film that obstruct the ductility of the aforementioned metal-core; and covering each of the ceramic films with insulated resin films, to cover the fragility of these ceramics.

Element mounting substrate and semiconductor module

A method for fabricating a semiconductor module includes: bonding a semiconductor substrate onto a first insulating resin layer; dicing the semiconductor substrate into a plurality of individual semiconductor devices; widening the spacings between the adjacent semiconductor devices by expanding the first insulating resin layer in a biaxially stretched manner; fixing the plurality of semiconductor devices to a flat sheet, with a second insulating resin layer held between the plurality of semiconductor devices and the flat sheet, and removing the first insulating resin layer; stacking the plurality of semiconductor devices, a third insulating resin layer, and a metallic plate, in this order, so as to form a laminated body having electrodes by which to electrically connect the device electrodes to the metallic plate; forming a wiring layer by selectively removing the metallic plate and forming a plurality of semiconductor modules; and separating the semiconductor modules into individual units.

Method for manufacturing semiconductor modules

A semiconductor module manufacturing method includes a step of bonding a semiconductor wafer, which has a plurality of semiconductor elements each of which has an element electrode formed thereon, on an expansible first insulating resin layer; a step of dicing the semiconductor wafer; a step of expanding the first insulating resin layer to widen a gap between semiconductor elements; a pressure-bonding step of pressure-bonding a metal plate whereupon an electrode is arranged and the semiconductor elements with the widened gaps in between, by having a second insulating resin layer in between, and electrically connecting the electrode and the element electrodes; a step of forming a wiring layer which corresponds to each semiconductor element by selectively removing the metal plate and forming a plurality of semiconductor modules connected by the first insulating resin layer and the second insulating resin layer; and a step of separating the semiconductor modules by cutting the first insulating resin layer and the second insulating resin layer.

Semiconductor module, method for fabricating the semiconductor module, and mobile apparatus

Methods for producing a substrate for mounting a device and for producing a semiconductor module are provided. The methods comprise preparing a metal plate on one major surface of which a plurality of projected electrodes are provided. An insulating resin layer is formed on the major surface so as to cover the top surface of the projected electrodes. The top surface of at least one of the plurality of projected electrodes is exposed by removing the insulating resin layer so that a major surface of the insulating resin layer opposite to the metal plate is level. A plurality of counter electrodes is arranged having a counterface to face the top face of the plurality of projected electrodes or a semiconductor device having a plurality of device electrodes is arranged to face the top face of the plurality of projected electrodes. The at least one of the plurality of projected electrodes, the top surface of which is exposed, is electrically connected with at least one of the plurality of counter electrodes facing the projected electrodes, by pressure-bonding the metal plate with the counter electrode. A wiring layer is formed by selectively removing the metal plate.

Method for producing substrate for mounting device and method for producing a semiconductor module

A circuit board includes a substrate made principally of metal. An opening is provided on the substrate. A first wiring layer is provided on one surface of the substrate via a first insulating layer, and a second wiring layer is provided on the other surface of the substrate via a second insulating layer. A conductor penetrates the substrate via the opening and connects the first wiring layer with the second wiring layer. An end of the opening at one surface side of the substrate has a tapering form on a surface layer thereof, and the first insulating layer has a recess on an upper surface thereof in an upper region of the opening.

Circuit board and method for manufacturing semiconductor modules and circuit boards

A semiconductor element mounted on an insulating resin layer formed on a wiring layer is sealed by a sealing resin. On the wiring layer, a protruding electrode protruding to the side of the semiconductor element and a protruding section are integrally formed with the wiring layer, respectively. The protruding electrode is electrically connected to an element electrode of the semiconductor element by penetrating the insulating resin layer. The protruding section is arranged to surround the semiconductor element along the four sides of the semiconductor element, and is embedded in the sealing resin up to a position above a section where the protruding electrode and the element electrode are bonded.

Semiconductor module and portable apparatus provided with semiconductor module

A device mounting board includes: an insulating resin layer; a wiring layer provided on one main surface of the insulating resin layer; and a bump electrode, electrically connected to the wiring layer, which is protruded from the wiring layer toward the insulating resin layer. Asperities are formed on the side surface of the bump electrode and the surface roughness of the side surface of the bump electrode is greater than that of the top surface of the bump electrode.

Device mounting board, and semiconductor module and manufacturing method therefor

A circuit device includes an insulating base provided with a resin layer mixed with a fibrous filler, bumps provided in the insulating base and functioning as electrodes for connection, a semiconductor device that is flip-chip mounted, and an underfill filling a gap between the semiconductor device and the insulating base. By allowing the fibrous filler projecting through the top surface of the resin layer to be in contact with the underfill, strength of adhesion between the underfill and the insulating base is improved.

Circuit device, method of manufacturing the circuit device, device mounting board and semiconductor module

To reduce connection defects between a circuit substrate provided on a core substrate and a circuit to be mounted thereon, thereby improving reliability as a multilayered device mounting substrate. The device mounting substrate includes: a first circuit substrate composed of a substrate, an insulating layer formed on this substrate, and a first conductive layer (including conductive parts) formed on this insulating layer; and a second circuit substrate mounted on the first circuit substrate, being composed of a base, a second conductive layer (including conductive parts) formed on the bottom of the base, and a third conductive layer (including conductive parts) formed on the top of the base. Here, the first and second circuit substrates are bonded by pressure so that the first and second conductive parts are laminated and embedded together into the insulating layer. The first and second conductive parts form connecting areas in the insulating layer, thereby connecting the first and second circuit substrates electrically.

Methods for manufacturing device mounting board and circuit substrate

A phase-change channel transistor includes a first electrode; a second electrode; a memory layer provided between the first and second electrodes; and a third electrode provided for the memory layer with an insulating film interposed therebetween, wherein the memory layer includes at least a first layer formed from a phase-change material which is stable in either an amorphous phase or a crystalline phase at room temperature and a second layer formed from a resistive material, and wherein the resistance value of the second layer is smaller than the resistance value of the first layer in the amorphous phase, but is larger than the resistance value of the first layer in the crystalline phase.

Phase-change memory device, phase-change channel transistor and memory cell array

A device mounting board includes an insulating layer formed of an insulating resin, a glass cloth covering the surface of the insulating layer, and an electrode provided in a through hole extending through the glass cloth. The angle of contact with solder of the glass cloth is larger than that of the resin. Thus, solder bumps are formed on the electrodeof the device mounting boardwith high precision.

Growing community of inventors

Ogaki, Japan

Mayumi Nakasato