Kabushiki Kaisha Toshiba

Tokyo Institute of Technology

Mayumi Machino

Akira Tanaka

Kazuhito Higuchi

Masayuki Uchida

Satoru Yasui

Masaya Hirashima

Yusaku Asano

Toshiya Nakayama

Yasunari Ukita

Kazuma Hiraguri

Masato Sone

Tso-Fu Mark Chang

Kyoko Honma

An electroplating method according to an embodiment is a electroplating method of generating a metal film on a cathode surface by setting a negative potential to a cathode of an anode and the cathode provided in a reaction bath, including mixing and accommodating a plating solution containing at least plated metal ions, an electrolyte, and a surface active agent and a supercritical fluid in the reaction bath and applying a current in a concentration of the supercritical fluid and a cathode current density in which a polarization resistance obtained from a cathode polarization curve while the plated metal ions are reduced is larger than before the supercritical fluid is mixed.

Electroplating method and electroplating device

A card connector includes a base, a shell and a contact. The contact has a contact portion, a first elastic portion and a second elastic portion. The contact portion abuts an electrode of an IC card inserted into a slot between the base and the shell. The first elastic portion extends from the contact portion in an insertion direction of the IC card and has a first end fixed to the base. The second elastic portion extends from the contact portion in an ejection direction of the IC card and has a second end fixed to the base.

Card connector

Growing community of inventors

Kawasaki, Japan

Mayumi Machino