Nichia Corporation

Mayumi Fukuda

Tomohisa Kishimoto

A method for manufacturing a package includes: preparing a lead frame that, in a region where the package is to be formed, has first and second electrodes, and has a through-hole at a position that spans across outer edges of the region; clamping the first and second electrodes between upper and lower molding dies; injecting a first resin into the molding dies, through an injection opening formed adjacent to the first electrode and on the outside of the region, so that the first resin has a wall that constitutes a side wall of a bottomed concave component with an outer lead component protruding outward from the wall, and a height of the side wall is larger than a thickness of the outer lead component; curing or solidifying the injected first resin; and cutting out an injection mark by cutting the lead frame at the outer edges of the region.

Package including lead component having recess

A method for manufacturing a lead frame including: punching a metal plate disposed on a die with a punch in a direction from the metal plate toward a die side to form a punched metal, the punched metal including at least one electrode, at least one hanger lead separated from the at least one electrode, and an outer frame connected to the at least one electrode and the at least one hanger lead; and stamping at least part of a corner of an end of the at least one hanger lead, the corner being on a side corresponding to the die side, with a vertically split mold to form at least one chamfered surface.

Method for manufacturing lead frame including electrode and hanger lead, method for manufacturing package having lead frame, and method for manufacturing light-emitting device having package

A method for producing a lead frame includes press-punching a metal sheet to form the lead frame such that a radius of curvature at a corner of a lower face of each of electrodes is larger than a radius of curvature at a corner of an upper face of each of the electrodes while a radius of curvature at a corner of a lower face of each of hanger leads is smaller than a radius of curvature at a corner of an upper face of each of the hanger leads. The lead frame includes the electrodes, the hanger leads spaced apart from the electrodes, and an outer frame attached to the electrodes and the hanger leads. The lead frame partially defines a box-shaped package that defines a first recess having an opening defining by the support member and a bottom face at least partially formed by the electrodes.

Method for producing lead frame, method for producing package and method for producing light emitting device

A package includes a first electrode and a second electrode that are located at a bottom portion of a bottomed recess, and a first resin securing the first electrode and the second electrode in place and forming a part of the bottomed recess. The first electrode has a first outer lead having a first indentation at a tip in a plan view. The second electrode has a second outer lead having a second indentation at a tip in a plan view. The first resin has at least a portion between the first electrode and the second electrode located at the bottom portion of the bottomed recess, wall portions structuring lateral walls of the bottomed recess, and flange portions having the same thickness as a thickness of the first outer lead and different outward widths from the wall portions on both sides of the first outer lead in a plan view.

Package and light emitting device

A lead frame includes a first electrode, a second electrode, two hanger leads, and an outer frame, and partially forms a box-shaped package which has a first recess for mounting a light emitting element as combined with a support member that supports the first electrode and the second electrode. At least a portion of lower faces of the electrodes, at least a portion of lower faces of the hanger leads, and at least a portion of a lower face of the planned formation area for the support member are coplanarly formed. Lower face corners of the first electrode and the second electrode are rounded while upper face corners of the first electrode and the second electrode are not rounded, and upper face corners of the hanger leads are rounded while lower face corners of the hanger leads are not rounded.

Lead frame, package and light emitting device

A package has a first electrode, a second electrode, and a first resin body. The first resin body has a retainer portion and a wall portion. The retainer portion retains the first electrode and the second electrode and forms a bottom portion of the package together with the first electrode and the second electrode. The wall portion surrounds a mounting region on the bottom portion and has a pair of opposite outer sides. Each of the first electrode and the second electrode has an outer lead portion extending outwardly from respective one of the pair of opposite outer sides of the wall portion. The first resin body further has a flange portion having parts extending from the pair of opposite outer sides of the wall portion. Each of the outer lead portions extends outwardly beyond a distal end of the corresponding part of the flange portion in plan view.

Package and package intermediate body

A package includes a first electrode, a second electrode, a wall, and a flange. The polarity of the second electrode is different from that of the first electrode, and at least one of the first electrode and the second electrode has an outer lead component that has a recess formed at a distal end. The wall fixes the first electrode and the second electrode, constitutes a side wall of a bottomed concave component in which at least part of a bottom surface of the bottomed concave component is constituted by the first electrode and the second electrode, and has the outer lead component protruded therefrom. The flange protrudes outward from the wall, and is provided with the same thickness as the outer lead component, on two sides of the outer lead component in plan view where the recess is not formed.

A package has a bottomed recess with a bottom portion. The package includes: a first electrode having a first outer lead portion and disposed in the bottom portion; a second electrode having a second outer lead portion and disposed in the bottom portion; and a first resin fixing the first electrode and the second electrode and constituting a part of the bottomed recess. The first resin has: a part between the first electrode and the second electrode disposed in the bottom portion; a wall portion constituting side walls of the bottomed recess; and a flange portion having a first part located adjacent to at least one of both sides of the first outer lead portion in plan view. The first part has a thickness different from a thickness of the first outer lead portion. A light emitting has: the package; and a light emitting element mounted on at least one of the first electrode and the second electrode of the package.

A lead frame includes an electrode, a hanger lead, and an outer frame and is formed integrally with a supporting member supporting the electrode, so that a package having a depression in which a light-emitting element will be mounted is formed. The depression is open on the upper side, its side walls are mainly constituted of the supporting member, and at least a part of its bottom surface includes the electrode. The electrode is disposed in a supporting member forming region. The hanger lead extends from the outer frame to reach the supporting member forming region. A chamfered surface is formed on at least a part of an upper side corner of an end of the hanger lead.

Lead frame including hanger lead, package, and light-emitting device

A method for manufacturing a package includes a step of injecting a first resin through an injection port of a dies in which a lead frame has been placed. The method includes a step of cutting out a portion of a border between a first electrode and a first connection portion running through a first through hole, and cutting out a portion of a border between a second electrode and a second connection portion running through a second through hole after molding the first resin. The method includes a step of electroplating the first and second electrodes. The method includes a step of cutting out a remaining portion of the border between the first electrode and the first connection portion, and cutting out a remaining portion of the border between the second electrode and the second connection portion.

Method for manufacturing package, method for manufacturing light emitting device, package, and light emitting device

A method for manufacturing a package includes the steps of: preparing a lead frame having a frame, a first electrode, a second electrode, a first connecting portion connecting the frame and the first electrode, and a second connecting portion connecting the frame and the second electrode; placing the lead frame in a mold; injecting a first resin into the mold from an inlet of the mold located adjacent to the first electrode to mold a flange portion and a wall portion of the package; and cutting the lead frame and a part of the flange portion located adjacent to the first electrode. In the step of injecting the first resin, the mold and the lead frame together provide a hollow space into which the first resin is injected and in which a part of the flange portion is formed so as to have a thickness different from a thickness of the lead frame.

Package manufacturing method, light emitting device manufacturing method, package, and light emitting device

Lead frame, package, light emitting device, and method for producing the same

Package, package intermediate body, light emitting device, method for manufacturing same

A method for manufacturing a package, includes preparing a lead frame that, in a region where the package is to be formed, has a first electrode and a second electrode that is different from the first electrode; clamping the first electrode and the second electrode between an upper molding die and a lower molding die; injecting a first resin into the molding dies between which the first electrode and the second electrode have been clamped, through an injection opening formed adjacent to the first electrode and on the outside of the region where the package is to be formed; curing or solidifying the injected first resin; and cutting out an injection mark of the injection opening for the first resin from next to the first electrode after the first resin has been cured or solidified.

Growing community of inventors

Tokushima, Japan

Mayumi Fukuda