Daikin Industries, Ltd.

Mayuko Tatemichi

Kouji Yokotani

Nobuyuki Komatsu

Takeshi Hazama

Eri Mukai

Akio Higaki

Meiten Koh

Tatsuya Higuchi

Miharu Ota

Keiko Yamazaki

Tomohiro Tanaka

Takahiro Kitahara

Takashi Kanemura

Tetsuhiro Kodani

Hisako Nakamura

Kakeru Hanabusa

Takuma Kawabe

Keiko Koga

A fluororesin film contains a fluororesin. The fluororesin contains two fluororesin species having different composition ratios of polymerized units. The fluororesin film has on at least one surface thereof a ten-point average roughness of 0.100 to 1.200 μm and an arithmetic average roughness of 0.010 to 0.050 μm, and the fluororesin film has a breakdown strength of 400 V/μm or higher.

Fluororesin film

A radio wave absorbing material including a fluoropolymer. The fluoropolymer contains a vinylidene fluoride unit, and the radio wave absorbing material absorbs a radio wave having a frequency in a range of 1 MHz to 100 MHz.

Radio wave absorbing material and radio wave absorbing sheet

A film having a dielectric dissipation factor at a frequency of 1 kHz and 160° C. of 0.02% or lower and a dielectric breakdown strength at 160° C. of 400 V/μm or higher. Also disclosed is a film including at least one fluoropolymer selected from a tetrafluoroethylene/perfluoro(alkyl vinyl ether) copolymer and a tetrafluoroethylene/hexafluoropropylene copolymer, the fluoropolymer having a crystallinity of 65% or higher.

Film

The invention provides a film having a high relative permittivity, a high volume resistivity, and a high breakdown strength. The film has a relative permittivity of 9 or higher at a frequency of 1 kHz and 30&#xb0; C., a volume resistivity of 5E+15 &#x3a9;&#xb7;cm or higher at 30&#xb0; C., and a breakdown strength of 500 V/&#x3bc;m or higher.

Film including a fluoropolymer

A fluororesin film containing a fluororesin. The fluororesin film has on at least one surface thereof a ten-point average roughness of 0.100 to 1.200 &#x3bc;m and an arithmetic average roughness of 0.010 to 0.050 &#x3bc;m. Further, the fluororesin film has a breakdown strength of 400 V/&#x3bc;m or higher.

The present invention provides a film having excellent heat resistance and a small difference between the permittivity at low temperatures and the permittivity at high temperatures. The present invention provides a film having a relative permittivity of 8 or more at a frequency of 1 kHz at 30&#xb0; C., wherein the rate of change is &#x2212;8 to +8% as calculated from a relative permittivity A at a frequency of 1 kHz at 30&#xb0; C. and a relative permittivity B at a frequency of 1 kHz at 150&#xb0; C. according to the following formula:Rate of change(%)=()/100.

Provided is a film for a film capacitor in which electrical insulation, and especially electrical properties at high temperatures are improved while a high dielectric constant of a vinylidene fluoride resin is maintained. The film for a film capacitor includes a tetrafluoroethylene resin (a1) that includes a vinylidene fluoride unit and a tetrafluoroethylene unit in the vinylidene fluoride unit/tetrafluoroethylene unit ratio (mol %) of 0/100 to 49/51 as a film-forming resin (A).

Film for use in film capacitors, and film capacitors

The present invention provides a high dielectric film for a film capacitor obtained by molding a film forming composition for a film capacitor comprising a thermoplastic resin (A) and surface-treated high dielectric inorganic particles (B) obtained by treating the surfaces of high dielectric inorganic particles (b1) having a dielectric constant (20&#xb0; C., 1 kHz) of 100 or more with a low dielectric compound (b2) having a dielectric constant (20&#xb0; C., 1 kHz) of 10 or less. This high dielectric film for a film capacitor can restrain the decrease of electrical insulating property, in spite of the high dielectric inorganic particles being dispersed at a high filling rate.

Composition for forming high dielectric film for film capacitor

There is provided a thin highly dielectric film for a film capacitor being excellent in mechanical strength, in which highly dielectric inorganic particles can be blended to a dielectric resin at high ratio, and rubber particles (B) and preferably highly dielectric inorganic particles (C) are dispersed in a thermoplastic resin (A).

Film for film capacitor and film capacitor

The present invention provides a nonporous highly dielectric film which can improve withstanding voltage, insulating property and dielectric constant, especially can decrease a dielectric loss at high temperatures and can be made thin, and a coating composition for forming the highly dielectric film comprising (A) a vinylidene fluoride resin, (B) a cellulose resin and (C) a solvent.

Growing community of inventors

Settsu, Japan

Mayuko Tatemichi