Infineon Technologies Ag

Infineon Technologies Dresden Gmbh

Mayk Roehrich

Robert Strenz

Wolfram Langheinrich

Achim Gratz

John Power

Martin Stiftinger

Danny Shum

Robert Wiesner

Josef Willer

Thomas Nirschl

Thomas Kuenemund

Herbert Palm

Michael Bollu

David San Segundo Bello

Veronika Polei

Klaus Knobloch

Jakob Kriz

Thomas Pötscher

Christoph Bukethal

Benno Muhlbacher

Joachim Gratz

Evelyne Kricki

Andreas Weisbauer

According to one embodiment, a semiconductor chip is described including a semiconductor chip body and a semiconductor chip circuit on the body and including a first circuit path coupled to a first and a second node and including at least two gate-insulator-semiconductor structures and a second circuit path coupled to the first and the second node and including at least two gate-insulator-semiconductor structures. The first and the second circuit path are connected to set the first and the second node to complementary logic states. In each of the first and the second circuit path, at least one of the gate-insulator-semiconductor structures is configured as field effect transistor. In at least one of the first and the second circuit path, at least one of the gate-insulator-semiconductor structures is configured to connect the circuit path to the semiconductor body.

Semiconductor chip

In various embodiments, a level shifter and a method for operating the same are provided. The level shifter may include a low supply voltage terminal, a high supply voltage terminal, at least one input terminal, at least one output terminal, and a latch. The latch may configured to: store a predetermined logic state by setting a storage node to a voltage level in response to receiving a predetermined voltage level at the at least one input terminal; amend the voltage level at the storage node in response to receiving an amended voltage/s at the low supply voltage terminal and/or at the high supply voltage terminal; and output the predetermined logic state having the amended voltage level from the storage node to the at least one output.

Level shifter and method for operating the same

A method for processing a carrier accordance with various embodiments may include: forming a structure over the carrier, the structure including at least two adjacent structure elements arranged at a first distance between the same; depositing a spacer layer over the structure, wherein the spacer layer may be deposited having a thickness greater than half of the first distance, wherein the spacer layer may include electrically conductive spacer material; removing a portion of the spacer layer, wherein spacer material of the spacer layer may remain in a region between the at least two adjacent structure elements; and electrically contacting the remaining spacer material.

Chip and an electronic device

Method for processing a carrier, method for fabricating a charge storage memory cell, method for processing a chip, and method for electrically contacting a spacer structure

In an embodiment of the invention, a memory cell arrangement includes a substrate and at least one memory cell including a charge storing memory cell structure and a select structure. The memory cell arrangement further includes a first doping well, a second doping well and a third doping well arranged within the substrate, wherein the charge storing memory cell structure is arranged in or above the first doping well, the first doping well is arranged within the second doping well, and the second doping well is arranged within the third doping well. The memory cell arrangement further includes a control circuit coupled with the memory cell and configured to control the memory cell such that the charge storing memory cell structure is programmed or erased by charging or discharging the charge storing memory cell structure via at least the first doping well.

Memory cell arrangement, method for controlling a memory cell, memory array and electronic device

In an embodiment, a memory cell arrangement is provided. The memory cell arrangement may include a first memory cell and a second memory cell, a first source/drain line coupled to a first source/drain region of the first memory cell and a second source/drain line coupled to a second source/drain region of the first memory cell, and a third source/drain line coupled to a first source/drain region of the second memory cell and a fourth source/drain line coupled to a second source/drain region of the second memory cell, wherein the third source/drain line is disposed proximate to the second source/drain line, and wherein the third source/drain line is disposed in the same metallization level as the second source/drain line.

Memory cell arrangements

One or more embodiments, relate to a field effect transistor, comprising: a substrate; a gate stack disposed over the substrate, the gate stack comprising a gate electrode overlying a gate dielectric; and a sidewall spacer may be disposed over the substrate and laterally disposed from the gate stack, the spacer comprising a polysilicon material.

Semiconductor device and method for making same

A semiconductor device can be fabricated by forming a floating gate layer over a semiconductor body. The floating gate layer is at least partially arranged over an insulation region in the semiconductor body. The floating gate layer is patterned to expose a portion of the insulation region. A recess is formed in a portion of the insulation region exposed by the patterned floating gate layer. A conductor is deposited within the recess. The conductor serves as a buried bitline. An insulator can then be formed within the recess over the conductor.

Method for producing bit lines for UCP flash memories

A class D power output stage for switching a supply voltage comprises a limiting transistor with a controllable path and a control terminal, a complementary limiting transistor with a controllable path and a control terminal, a switching transistor with a controllable path and a control terminal, and a complementary switching transistor with a controllable path and a control terminal. A switched output signal between the controllable paths of the limiting and complementary limiting transistors can be taped off, the controllable paths of the limiting and the complementary limiting transistors are connected together and are connected to a first and a second supply terminal via the controllable paths of the switching and complementary switching transistors, and the switching and the complementary switching transistors have a lower electrical strength than the limiting and complementary limiting transistors. The output stage further comprises a level matching device for generating control signals in response to an input switching signal. The matching device is connected to the supply voltage and the control signals are fed to the control terminals.

Power output stage

A flash memory cell can be read by selecting a local bit line. A read potential is applied to a memory cell transistor associated with the local bit line thereby generating a capacitive loading of the local bit line. The capacitive loading depends upon a magnitude of charge stored on a floating gate of the memory cell transistor. The capacitive loading of the local bit line can then be assessed to determine a state of the memory cell transistor, the state being related to the magnitude of the charge stored on the floating gate.

Method for reading Uniform Channel Program (UCP) flash memory cells

Each memory cell is a memory transistor which is provided on a top side of a semiconductor body and has a gate electrode which is arranged in a trench located between a source region and a drain region that are formed in the semiconductor material. The gate electrode is separated from the semiconductor material by a dielectric material. At least between the source region and the gate electrode and between the drain region and the gate electrode, there is an oxide-nitride-oxide layer sequence. The layer sequence is provided for the purpose of trapping charge carriers at the source and the drain.

Growing community of inventors

Dresden, Germany

Mayk Roehrich