Unity Semiconductor Corporation

Mayeul Durand De Gevigney

Philippe Gastaldo

Yueh Sheng Ow

Kaiss Benhadjsalem

Guillaume Vienne

Tristan Combier

Christophe Isnard

A system for optical inspection of a substrate. The system comprises an illumination device defining an inspection area on the substrate, a support to receive the substrate, and a detection device defining a detection area on the substrate. The inspection area is positioned ahead, with respect to the scanning direction, of at least a portion of the detection area.

System for optical inspection of a substrate using same or different wavelengths

An adapter for retaining a wafer has a back side intended to be placed on, and to extend over, a first suction channel and a second suction channel disposed on a main face of a support. The adapter has a shallow recess disposed on the front side to receive the wafer, the shallow recess being shaped to the wafer size and having a flat base to contact a surface of the wafer. The adapter also includes a vacuum network extending through the adapter and comprising at least one through-passage connecting the adapter back side and the adapter front side, the through-passage opening out, on the front side, in the shallow recess. The through-passage intercepts, on the back side, the first suction channel of the support but not the second suction channel.

Substrate dimension adapter

A device for dark-field optical inspection of a substrate comprises: a light source for generating an incident beam that is projected onto an inspection zone of the substrate and that is capable of being reflected in the form of diffuse radiation; at least one first and one second collecting device; and a reflecting device for directing at least a portion of the diffuse radiation originating from a focal point of collection coincident with the inspection zone in the direction of the collecting devices, with a first and second reflective zone from which a first portion of the diffuse radiation is directed toward a first focal point, which is optically conjugated with the focal point of collection, and a second portion of the diffuse radiation is reflected toward a second focal point, which is optically conjugated with the collection focal point and distinct from the first focal point of detection.

Dark-field optical inspection device

A method and related system for substrate inspection, includes: creating, based on two light beams originating from one light source, a measurement volume at the intersection between the two light beams, the measurement volume containing interference fringes and being positioned to extend into the substrate, the substrate moving relative to the measurement volume in a direction parallel to a main surface S of the substrate; acquiring a measurement signal representative of the light scattered by the substrate, as a function of the location of the measurement volume on the substrate; calculating at least one expected modulation frequency, of an expected signal representative of the passage of a defect of the substrate through the measurement volume; determining values representative of a frequency content of the measurement signal close to the modulation frequency, to constitute a validated signal representative of the presence of defects; and analyzing the signal to locate and/or identify defects.

Method and system for optically inspecting a substrate

A method for inspecting a wafer including:

Method and system for inspecting boards for microelectronics or optics by laser doppler effect

An electronic wafer inspecting method includes:

Interferometric method and system using variable fringe spacing for inspecting transparent wafers for electronics, optics or optoelectronics

A method for inspecting a wafer, includes:

Growing community of inventors

Meylan, France

Mayeul Durand De Gevigney