Avago Technologies International Sales Pte. Limited

Mayank Mayukh

Liming Tsau

Reza Sharifi

Sam Komarapalayam Karikalan

Sam Ziqun Zhao

Arun Ramakrishnan

Dharmendra Saraswat

Nicole A Butel

Shrikara Prabhu Tendel

A semiconductor package with integrated side wall antennas is provided. An apparatus includes two or more die layers that are bonded together, each of the two or more die layers comprising a top surface, bottom surface, and one or more side walls. A first side wall of the one or more side walls includes a first antenna array, the first antenna array comprising a first plurality of antenna array elements formed in at least one of the two or more die layers, wherein the first plurality of antenna array elements is at least partially exposed at the first side wall.

Integrated antennas on side wall of 3D stacked die

An integrated circuit (IC) package includes a one or more die, a package substrate, a thermal interface material, and a cover. The cover is disposed over or above the one or more die. The thermal interface material includes a surface modified metal and a silicon monomer.

Polymerized thermal interface material with surface modified liquid metal spheres and method of making

Novel tools and techniques are provided for implementing cantilevered power planes to provide a return current path for high-speed signals. In various embodiments, a semiconductor package includes a substrate core, a plurality of layers, and an AC coupler(s). The plurality of layers includes power, ground, and signal layers each layer disposed on or above the substrate core, each signal layer being disposed between a power layer and a ground layer, the power layer and the ground layer each providing a return path for high frequency (e.g., 1 kHz or greater) signals carried by each signal layer. Each dielectric layer is disposed between and in contact with a pair of power, ground, or signal layer. The AC coupler(s) is coupled to each of a power layer(s) and a ground layer(s), without any portion of any power layer that is near an edge of the substrate core being anchored to the substrate core.

Cantilevered power planes to provide a return current path for high-speed signals

An apparatus includes a substrate that includes one or more routing layers, and an optical module coupled to the substrate. The optical module includes a photonic integrated circuit (PIC) and electronic integrated circuit (EIC), wherein the photonic integrated circuit is at least partially embedded within the substrate. The apparatus further includes a fiber optic coupler coupled to at least one of the substrate or PIC, wherein the PIC is configured to transmit or receive an optical signal via the fiber optic coupler.

Growing community of inventors

Fort Collins, CO, United States of America

Mayank Mayukh