Infineon Technologies Ag

May Ting Hng

Chee Chian Lim

Yoke Chin Goh

Koh Hoo Goh

An electronic component includes lead fingers and a die paddle. A tape pad is mounted below the lead fingers and the die paddle. A first semiconductor chip is bonded onto the tape pad by a layer of first adhesive and a second semiconductor chip is bonded onto the die paddle by a layer of second adhesive. Electrical contacts are disposed between the contact areas of the semiconductors chips and the lead fingers. An encapsulating compound covers part of the lead fingers, the tape pad, the semiconductor chips and the electrical contacts.

Multi-chip electronic package with reduced stress

An electronic component includes a number of leads and at least one cooling element. The bottom surface of the cooling element is exposed and the material of the cooling element is different from the material of the leads. At least one semiconductor chip is provided on the cooling element. An encapsulation compound covers at least part of the leads, at least part of the semiconductor chip(s), and at least part of the cooling element(s).

Growing community of inventors

Bukit Baru Melaka, Malaysia

May Ting Hng