Allegro Microsystems, LLC

Maxwell McNally

Alexander Latham

Shixi Louis Liu

Loïc André Messier

Simon Rock

Steven Daubert

Andreas P Friedrich

Yannick Vuillermet

Srujan Shivanakere

Tyler Daigle

William P Taylor

Shaun D Milano

Georges El Bacha

Wade Bussing

Sina Haji Alizad

Kevin Buckley

Alec Smith

Methods and apparatus for a magnetic field sensor IC package having groups of arrays of TMR elements each having a pinning direction. An on-chip coil is routed under the TMR elements to conduct current for generating a magnetic field to stimulate the TMR elements. The device may be configured to sense changes in an applied magnetic field.

TMR sensor having magnetic field generation for pillar stimulation

Methods and apparatus for a current sensor integrated circuit package that includes a die having a first magnetic field sensing element and a leadframe to support the die. The leadframe has a U-shaped current conductor loop with a throat region and a first notch in the throat region of the current conductor loop. A first magnetic field sensing element is positioned in relation to the first notch. In some embodiments, the first magnetic field sensing element is aligned with an edge of the first notch.

Current sensor integrated circuit

A current sensor IC includes a lead frame having a die attach pad and elongated leads extending in a single direction with respect to the die attach pad, a semiconductor die having a first surface attached to the die attach pad and a second, opposing surface supporting magnetic field sensing elements, and a non-conductive mold material. A first portion of the mold material encloses the semiconductor die and the die attach pad, a second portion of the mold material encloses a portion of the elongated leads, and the mold material further includes a wing structure between the first portion and the second portion. In assembly, the first portion of the mold material extends into a cutout through a current conductor and the wing structure abuts a surface of the conductor. The current sensor can implement differential sensing based on signals from at least two magnetic field sensing elements.

Sensor package and system

Auto-calibrating current sensor integrated circuits (ICs) are configured for mounting at a position relative to a conductor. The auto-calibrating current sensor ICs can include a plurality of magnetic field sensing elements disposed at different locations within the integrated circuit, respectively, and can be configured to measure a magnetic field produced by a current carried by the conductor. The auto-calibrating sensors can include an electromagnetic model of the IC and the conductor. The model can be operative to determine a magnetic field at points in space due to a given current in the conductor at a known location of the conductor from the IC, and also the inverse situation of determining an unknown current and/or location of the conductor based on measurements of a magnetic field at known locations in space due to an unknown current in the conductor. Related auto-calibration methods are also described.

Auto-calibration for coreless current sensors

Methods and apparatus for canceling inductive coupling in a magnetic field sensing device having one or more Hall elements. A device can include a Hall element having a first pair of first and second voltage sensing terminals at diametrically opposed locations on the Hall element, and a second pair of third and fourth voltage sensing terminals diametrically opposed locations on the Hall element. A first mirror conductive path extends around a perimeter of the Hall element in a first direction a second mirror conductive path extends around the perimeter of the Hall element in a second direction so that the first and second mirror conductive paths are on opposite sides of the Hall element and are equal and opposite to cancel inductive coupling.

Magnetic sensing having hall plate routing to reduce inductive coupling

A current sensor IC includes a unitary lead frame having a primary conductor with a first thickness and a secondary lead having a second thickness less than the first thickness. A semiconductor die adjacent to the primary conductor includes a magnetic field sensing circuit to sense a magnetic field associated with the current and generate a secondary signal indicative of the current. An insulation structure is disposed between the primary conductor and the die. A mold material encloses a first portion of the secondary lead and a second portion of the secondary lead that is exposed outside of the package has the second thickness. A method of manufacturing a current sensor IC includes providing a unitary lead frame sheet having a first thickness, decreasing a thickness of a portion of the sheet to provide a first portion with the first thickness and a second portion with a smaller thickness, and stamping the sheet to form a repeating lead frame pattern, with each pattern including a primary conductor formed from the first portion and secondary leads formed from the second portion.

Current sensor integrated circuit with a dual gauge lead frame

In one aspect, an electronic device includes a switching circuit connected to a resistance circuit and ground, the resistance circuit connected to a port and the port configured to be connected in series to an external resistor and a supply voltage. A voltage at the port is a first voltage that is less than the supply voltage if the switching circuit is enabled to be a closed circuit and the voltage at the port is a second voltage that is equal to the supply voltage if the switching circuit is enabled to be an open circuit.

Determining an action by an electronic device based on voltage at a port of the electronic device

Methods and apparatus for measuring a current difference between at least two primary current paths in a current sensor integrated circuit package. Each primary current path generated a magnetic field which may then be measured by at least one magnetic field sensing element positioned on an integrated circuit die. An output disconnect signal may be provided from the current sensor integrated circuit package when a current difference above a predetermined threshold exists in the two or more current traces.

Differential current sensor package

A current sensor includes a lead frame having a plurality of leads, at least two of which form a current conductor configured to carry a current that generates a magnetic field and a substrate having first and second opposing surfaces, the first surface proximate to said current conductor and the second surface distal from the current conductor. A first magnetic field transducer is disposed on the substrate and a first coil is disposed on the substrate adjacent to the first magnetic field transducer, wherein the first magnetic field transducer and the first coil are positioned on a first side of the current conductor. A second magnetic field transducer is disposed on the substrate and a second coil is disposed on the substrate adjacent to the second magnetic field transducer, wherein the second magnetic field transducer and the second coil are positioned on a second side of the current conductor.

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Manchester, NH, United States of America

Maxwell McNally