Amkor Technology, Inc.

Maximilien d'Estries

Jeffrey Alan Miks

Stephen Gregory Shermer

Curtis Michael Zwenger

Brenda Gogue

A circuit module for use in a memory card. The circuit module comprises a base substrate including a plurality of contacts. Attached to the base substrate is a memory die, while attached to the memory die is an interposer having a plurality of terminals electrically connected to each other in a prescribed pattern. At least one of the terminals is electrically connected to at least one of the contacts. Attached to the interposer is a controller die, with the memory die and the controller die each being electrically connected to at least one of the terminals of the interposer.

Interposer for interconnecting components in a memory card

A memory card comprising a leadframe having a die pad, and an insert having a plurality of contacts. Attached to the die pad is a semiconductor die which is electrically connected to the contacts of the insert. A body covers the die pad and the semiconductor die and partially covers the insert such that the contacts are exposed in an exterior surface of the body.

Memory card ESC substrate insert

A method of fabricating a memory card. The method comprises the initial step of providing a leadframe which has a dambar and a plurality of contacts, each of the contacts being attached to the dambar by at least one tie bar. A layer of tape is applied to the leadframe such that the tape covers at least portions of the top contact surfaces of the contacts, at least portions of the top tie bar surfaces of the tie bars, and at least a portion of the top dambar surface of the dambar. Thereafter, the tie bars are removed from the leadframe. At least one semiconductor die is then electrically connected to the leadframe, with a body thereafter being formed on the leadframe such that the semiconductor die and the tape are covered by the body and the bottom contact surfaces are exposed in an exterior surface thereof.

Tape supported memory card leadframe structure

An electronic device such as a storage device or memory card comprising a unitary case having opposed first and second sides, a closed first end, an open second end, and an interior chamber collectively defined by the first and second sides and the first end. Disposed within the second side of case is a window which communicates with the interior chamber thereof. Disposed within the interior chamber is a substrate having a plurality of contacts. The substrate is oriented within the interior chamber of the case such that the contacts are exposed within the window thereof. The substrate is maintained in a prescribed position relative to the case by a spring clip which is also advanced into the interior chamber and is cooperatively engaged to the substrate.

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Mesa, AZ, United States of America

Maximilien d'Estries