Epcos Ag

Snaptrack Incorporated

Rf360 Singapore Pte. Ltd.

Siemens Matsushita Components Gmbh & Co Kg

Maximilian Pitschi

Juergen Kiwitt

Robert Koch

Jürgen Kiwitt

Andreas Fleckenstein

Christian Bauer

Andreas Przadka

Matthias Jungkunz

Peter Selmeier

Bernhard Bader

Gerhard Kloska

Tilo Gärtner

Jiman Yoon

Guillermo Moreno Granado

Luigi Rosetti

Andreas Tag

Peter M&uuml;ller

Aspects of the disclosure relate to wireless communication, and high-frequency filters with resonators. One example is a frequency band filter circuit having a split resonator. The split resonator comprises a resonator including a first section of a shared input busbar, a first section of a shared output busbar, and an electrode structure between the first section of the shared input busbar and the first section of the shared output busbar, the electrode structure configured for a resonance. The split resonator also comprises a detuned resonator. The detuned resonator includes a second section of the shared input busbar, a second section of the shared output busbar, and a detuned electrode structure between the second section of the shared input busbar and the second section of the shared output busbar, the detuned electrode structure configured for a detuned resonance different from the resonance.

Electroacoustic filter including split resonator with detuning

The invention relates to a BAW resonator with reduced heat build-up. The heat build-up is reduced by a thermal bridge, which dissipates heat from the electro-acoustically active region to a support substrate, without impairing the acoustics of the resonator.

BAW resonator with reduced heat build-up, HF filter comprising BAW resonator, duplexer comprising HF filter, and production method

A circuit arrangement can be used for adapting the electroacoustic properties of an electroacoustic component. The circuit arrangement includes a first conductor loop and a further element. The first conductor loop includes a main loop and a negative feedback loop. The negative feedback loop has a sense of curvature that is opposite to a sense of curvature of the main loop. The negative feedback loop compensates for a coupling between the main loop and the further element.

Circuit arrangement

An electrical component, e.g., a diplexer or a duplexer, can have one of a number of diverse arrangements for terminal surfaces on the substrate bottom. For example, the terminal surfaces for first and second filters are not disposed at the maximum distance from one another. First and second filters can be disposed as one or two discrete components on the substrate, wherein one filter can be implemented as being integrated in a multilayer substrate.

Electrical component

An RF component can have a reduced electromagnetic internal coupling and may be suitable for miniaturization as a result. The component includes a micro acoustic filter of ladder-type design in a housing and a double coil having a first coil segment and a second coil segment. The two coil segments are oriented in opposite directions. The two coil segments are arranged without crossover in one layer and the double coil is arranged in proximity to a parallel branch resonator of the ladder-type filter structure.

RF component with reduced coupling and suitable for miniaturization

The invention relates to a micro-acoustic filter having a first and a second converter, in which the electromagnetic and capacitive cross-talk between the first and second converters is compensated for by providing additional coupling capacitors and additional current loops. Additional coupling capacitors and current loops are arranged in such a manner that they can counteract the sign of the natural coupling specified by the design and thus completely compensate for said coupling.

Micro-acoustic filter having compensated cross-talk and method for compensation

A stable electrical component includes a carrier substrate and a chip () mounted thereon. The component has a reactance element and a supporting element, which are at least partly arranged between the carrier substrate and the chip. The reactance element is at least partly realized by means of at least one conductor track. The reactance element includes a coil, a capacitor or a transmission line.

Electrical Component

An electrical component includes a first signal path and a second signal path electrically connected to a common signal path. The electrical component also includes a first filter in the first signal path and a second filter in the second signal path. The electrical component also includes a first matching circuit comprising a shunt arm to ground. The first matching circuit is electrically connected to the first signal path, the second signal path, and the common signal path.

Electrical component for the front end circuit of a transceiver

A substrate with an HF-compatible line arranged in this substrate will be proposed that is formed similar to a tri-plate strip line in which, however, at least one of the ground planes has a slot that follows the profile of the signal line arranged between two ground planes. With the aid of this slot, the capacitive constant of the line can be lowered and thus the impedance of the line can be increased.

Substrate with embedded signal line and ground planes with a slot therein

A component operating with acoustic waves is described herein. The component includes a substrate having an underside subdivided into a center area and an edge area surrounding the center area on all sides. The component also includes a plurality of outer terminals in the edge area, and a plurality of inner terminals in the center area comprising at least a first inner terminal configured as a signal terminal.

Component operating on acoustic waves

A component includes a first filter configured to work with acoustic waves. The first filter includes a first sub-filter on a first chip and a second sub-filter on a second chip separate from the first chip. The first filter if a different type of filter, has a different layer structure, or has a different layer thicknesses for at least one layer in comparison to the second filter.

Component comprising at least one filter that operates with acoustic waves

A surface acoustic wave (SAW) filter includes a piezoelectric substrate, and acoustic tracks on the piezoelectric substrate. The acoustic tracks are adjacent and electrically interconnected. The acoustic tracks include electro-acoustic transducers. The electro-acoustic transducers include an input transducer and an output transducer. The SAW filter also includes a shielding structure that is metallic and that is connected to ground. The shielding structure is between the acoustic tracks. The shielding structure shields a first electro-acoustic transducer in a first acoustic track from a second electro-acoustic transducer in a second acoustic track.

Saw filter with improved selection or insulation

A surface acoustic wave (SAW) filter having an improved edge steepness includes at least three resonators connected in series and/or parallel with one another. An edge steepness of a pass band is improved if a plurality of resonators with different finger periodicities of interdigital transducers are provided.

Surface acoustic wave filter having an improved edge steepness via series resonators with different finger periodicities

A reactance filter, particularly in a branching circuit (ladder type),with surface wave resonators wherein omission weighted normal finger transducers are employed between reflectors such that the arrangement and plurality of the active fingers of the interdigital transducer are particularly formed for changing the capacitance relationship (static to dynamic capacitance) such that a narrow filter bandwidth is achieved.

Growing community of inventors

Rottach-Egern, Germany

Maximilian Pitschi