Wacker Siltronic Gesellschaft Fur Halbleitermaterialien Ag

Siltronic Ag

Maximilian Kaeser

Walter Frank

Christian Andrae

Albert Blank

Albert Pemwieser

Vernon Knepprath

A method for slicing a plurality of wafers from a crystal includes providing a crystal of semiconductor material having a longitudinal axis, a cross section and at least one pulling edge. The crystal is fixed on a table and guided through a wire gang defined by sawing wire so as to form the wafers. The guiding is provided by a relative movement between the table and the wire gang such that entry sawing or exit sawing using the sawing wire occurs in a vicinity of the at least one pulling edge of the crystal.

Method for slicing a multiplicity of wafers from a crystal composed of semiconductor material

A sawing wire is for the simultaneous cutting and lapping of a multiplicity of wafers from a hard brittle workpiece. The sawing wire exhibits torsion. There is also a method for cutting and lapping using the sawing wire.

Sawing wire and method for the cutting and lapping of hard brittle workpieces

A sawing suspension composition is composed of an essentially nonaqueous or anhydrous organic liquid in which hard-material particles are dispersed. The liquid is selected from a group of compounds which comprises low molecular weight polyglycols and any desired mixture of these polyglycols. The sawing suspension is used in conjunction with a wire saw for cutting wafers from a crystal of a brittle and hard material.

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Burghausen, Germany

Maximilian Kaeser