Basf Se Corporation

Dr. Ing. H.c. F. Porsche Aktiengesellschaft

Fraunhofer-gesellschaft Zur Foerderung Der Angewandten Forschung E.v.

Maximilian Hofmann

Klaus Hahn

Konrad Knoll

Philippe Desbois

Volker Warzelhan

Klemens Massonne

Frank Braun

Ingo Bellin

Patrick Spies

Sabine Fuchs

Geert Janssens

Hartmut Denecke

Robert Loos

Timijan Velic

Jochen Wagner

Olaf Kriha

Alois Kindler

Roland Hingmann

Christoph Fleckenstein

Peter Deglmann

Maximilian Barkow

Patrick Fuchs

Manfred Döring

Andreas Künkel

Sameer Nalawade

Rainer Perthold

Heinz Gerhauser

Jens Assmann

Michael Ciesielski

Holger Ruckdäschel

Carsten Schips

Daniela Longo-Schedel

Bernd Eckardt

Andre Mueller

Hubert Rauh

Benjamin Bayer

Jordan Sorge

Andreas Füβl

Bangaru Dharmapuri Sriramulu Sampath

Bangaru Sampath

Benjamin Nehls

Georg Gräβel

Christof Zylla

Andreas Kuenkel

Rainer Ostermann

Andreas Füßl

Andreas Füssl

Jurgen Lambert

Ciesielski Michael

Andreas Gietl

Daniela Longo

Ingo Rogalsky

Georg Grässel

Jürgen Lambert

Georg Gräßel

Jens Aßmann

Andreas Fuessl

Christian Exner

A power semiconductor module includes a first and second insulating substrate, which is arranged parallel to and at a distance from the first insulating substrate. The first insulating substrate and the second insulating substrate each include an insulating layer, an inner metallization layer, and an outer metallization layer. The power semiconductor module also includes a first cooling device, which is arranged thermally conductively on the outer metallization layer of the first insulating substrate, a second cooling device, which is arranged thermally conductively on the outer metallization layer of the second insulating substrate. The power semiconductor module also includes a power semiconductor, arranged between the first insulating substrate and the second insulating substrate. At least one of the two insulating substrates include a through-contact, by which the inner metallization layer of the corresponding insulating substrate is electrically connected to the outer metallization layer of the corresponding insulating substrate.

Power semiconductor module

A liquid-cooled power electronics unit includes a planar circuit board body having conductor tracks, a wet side with a wet space for carrying a dielectric cooling liquid, and a fluidically, separated dry side, wherein at least two high-voltage power semiconductors are arranged on the circuit board body on the wet side within the wet space, the high-voltage power semiconductors being cooled by the cooling liquid, and an electronic low-voltage circuit is arranged on the dry side of the circuit board body.

Liquid-cooled power electronics unit

The invention relates to a process for producing expandable pelletized material which comprises polylactic acid which comprises the following steps: The invention further relates to expandable pelletized material which comprises polylactic acid and which is obtainable by said process.

Method for producing expandable granulates containing polylactic acid

Use of a phosphorus compound of the formula (I) as flame retardant, where the definitions of the symbols in the formula (I) are as follows: 

Flame retardant

The invention relates to a process for producing expandable pelletized material which comprises polylactic acid which comprises the following steps: The invention further relates to expandable pelletized material which comprises polylactic acid and which is obtainable by said process, and also to specific expandable pelletized material which comprises polylactic acid and which has a proportion of from 3 to 7% by weight of an organic blowing agent, preferably n-pentane and particularly preferably isopentane. The invention further relates to a preferred process for producing expandable pelletized material which comprises blowing agent and which comprises polylactic acid, and which has low bulk density.

Expandable, thermoplastic polymer bead material composed of a multiphase polymer mixture which comprises blowing agent and has at least one continuous phase of a thermoplastic polymer, where at least two different disperse phases Pand Pare present, disperse in the continuous phase, and also to processes for its production, and to use for the production of elastic molded foams.

Elastic particle foam based on polyolefin/styrene polymer mixtures

Disclosed is a polymer foam with density in the range from 5 to 120 kg/mcomposed of a polymer component including at least one styrene polymer and from 0.1 to 5 parts by weight of a flame retardant mixture including at least one phosphorus compound of the formula PRRR. A process for producing the polymer is also disclosed.

Halogen-free, phosphorus-containing flame-retardant polymer foams

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Mannheim, Germany

Maximilian Hofmann