Robert Boschgmbh

Maximilian Amberger

Michael Stumber

Ulrike Scholz

Frederik Ante

Holger Hoefer

Gerald Brinks

Klaus Offterdinger

Tobias Zoller

A method for producing a micromechanical device having a damper structure. The method includes: (A) providing a micromechanical wafer having a rear side; (B) applying a liquid damper material onto the rear side; (C) pressing a matrix against the rear side in order to form at least one damper structure in the damper material; (D) curing the damper material; and (E) removing the matrix.

Method for producing a micromechanical device having a damper structure

A laser diode device includes a thermally conductive substrate that has a planar surface for dissipating ambient heat, and a plurality of laser diodes situated thereon, each of which includes at least one epitaxial layer that is situated on a side of the laser diode facing the substrate. The laser diodes are each electrically activated via an electrically conductive coating situated between the at least one epitaxial layer and the substrate. The substrate includes a plurality of metallized cavities that accommodate the plurality of laser diodes so that the plurality of laser diodes have an essentially uniform height above the substrate.

Laser diode device

A device for coupling electromagnetic waves into a chip or the like, including a cavity for accommodating a light source, an opening for the passage of light of the light source, which is connected to the cavity, the device including a first surface and a second surface situated opposite the first surface, at least one of the two surfaces including at least two first surface sections, which are inclined relative to one another at an inclination angle, and the distance between the first surface and the second surface being different on different sides of the cavity and/or of the opening, and surface areas on different sides of the cavity and/or opening respectively adjacent thereto having the identical inclination angle.

Method for coupling electromagnetic waves into a chip using a cavity for a light source and an opening, for passage of light of the light source, which is connected to the cavity

A microelectronic component arrangement includes a sensor and a carrier. The sensor has a detection surface and a region including contact elements situated at a first distance with respect to one another. The carrier includes a mounting surface, and the sensor is fixed on the carrier by the contact elements situated at a first distance with respect to one another at least regionally. The detection surface is opposite the mounting surface in a manner having a second distance with respect to the mounting surface. The contact elements are wetted by a mechanically stabilizing material, the region including the contact elements is enclosed by the mechanically stabilizing material, and the detection surface is free of the mechanically stabilizing material.

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Karlsruhe, Germany

Maximilian Amberger